Micro Semiconductor  Cooler's Paramater

Core Product Structure of Paltier Refrigerator

The 1.6×1.6mm miniature semiconductor cooling chip employs a multilayer ceramic-semiconductor composite structure. Core components include:

Ceramic Substrate: Upper and lower layers of insulating thermally conductive ceramics (typically aluminum oxide/aluminum nitride) provide electrical insulation and rapid heat transfer while protecting internal semiconductor particles.

Semiconductor Thermocouple Pairs: Composed of series-connected N-type and P-type bismuth telluride semiconductor grains, forming the core functional layer that realizes the Peltier effect. Direct current enables directional heat transfer.

Metal Conduction Layer: Copper/nickel conductive traces embedded between ceramic substrates. These connect thermocouple pairs to form a complete electrical circuit while aiding heat dissipation.

Electrode leads: Two metal wires connecting to an external DC power source, supplying operating current to the cooling module.

Micro Semiconductor  radiator‘s Working Principle

When an N-type semiconductor material and a P-type semiconductor material are joined to form a thermocouple, applying a direct current to this circuit induces energy transfer. The junction where current flows from the N-type element to the P-type element absorbs heat, becoming the cold junction, while the junction where current flows from the P-type element to the N-type element releases heat, becoming the hot junction. The magnitude of heat absorption and release is determined by the current strength and the number of semiconductor material N and P element pairs.

Model Selection of Micro Semiconductor  cooling plate

Micro Semiconductor  Heat sink's Application

With its ultra-compact 1.6×1.6mm size and high cooling density, it is particularly well-suited for scenarios with extremely limited space and demanding precise temperature control, such as consumer electronics, portable medical devices, optical communications, and small instruments.