Micro TEC Cooling System's Display

Micro Thermoelectric Cooler's Parameter

Product Features of 1.6×1.6mm Ultra-Miniature Semiconductor Thermoelectric Cooler

Ultra-miniature Size: 1.6×1.6mm chip-level footprint, only 0.9mm thick, ideal for high-density integration.

Precise Temperature Control: ±0.1℃ high accuracy, millisecond-level response, stabilizes temperature for lasers, sensors and medical chips.

High Efficiency & Low Power Consumption: Driven by 1A/0.97V low power, delivers 0.56W cooling capacity for local thermal management.

Multi-mode Functionality: Supports cooling, heating and thermoelectric power generation for versatile thermal energy applications.

High Reliability & Long Lifespan: All-solid-state design with no moving parts, ceramic substrate sealing, lifespan over 100,000 hours.

Flexible Customization: Customizable substrate materials, pin configurations and power levels to fit packaging for optical communications, medical and sensing industries.

Core Product Structure of Peltier Refrigerator

The 1.6×1.6mm miniature semiconductor cooling chip employs a multilayer ceramic-semiconductor composite structure. Core components include:

Ceramic Substrate: Upper and lower layers of insulating thermally conductive ceramics (typically aluminum oxide/aluminum nitride) provide electrical insulation and rapid heat transfer while protecting internal semiconductor particles.

Semiconductor Thermocouple Pairs: Composed of series-connected N-type and P-type bismuth telluride semiconductor grains, forming the core functional layer that realizes the Peltier effect. Direct current enables directional heat transfer.

Metal Conduction Layer: Copper/nickel conductive traces embedded between ceramic substrates. These connect thermocouple pairs to form a complete electrical circuit while aiding heat dissipation.

Electrode leads: Two metal wires connecting to an external DC power source, supplying operating current to the cooling module.

Micro Semiconductor  radiator's Working Principle

When an N-type semiconductor material and a P-type semiconductor material are joined to form a thermocouple, applying a direct current to this circuit induces energy transfer. The junction where current flows from the N-type element to the P-type element absorbs heat, becoming the cold junction, while the junction where current flows from the P-type element to the N-type element releases heat, becoming the hot junction. The magnitude of heat absorption and release is determined by the current strength and the number of semiconductor material N and P element pairs.

Model Selection of Micro Semiconductor  Cooling Plate

Micro TEC Product's Application

With its ultra-compact 1.6×1.6mm size and high cooling density, it is particularly well-suited for scenarios with extremely limited space and demanding precise temperature control, such as consumer electronics, portable medical devices, optical communications, and small instruments，Micro Night Vision、CGM、MEMS.....