35x76x4.2mm High Temperature Peltier Cooler for demanding thermal applications. This high temperature TEC module provides reliable thermoelectric cooling and heating performance. 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw

| Item | Specification |
|---|---|
| Product Type | High Temperature Peltier Cooler |
| Product Category | Micro Thermoelectric Cooler |
| Dimensions | 35 × 76 mm |
| Thickness | 4.2 mm |
| Technology | Thermoelectric / Peltier Effect |
| Structure | Compact Thermoelectric Module |
| Application | Cooling & Temperature Control |
| Customization | OEM / Custom Available |
The compact dimensions make this micro thermoelectric cooling module suitable for equipment with limited installation space.
The 35x76x4.2mm High Temperature Peltier Cooler is designed for compact thermal management applications requiring controlled heat transfer.
Compared with conventional larger cooling modules, this compact thermoelectric cooler can be integrated into systems where installation space is limited.
Depending on the actual system design, the module can be combined with heat sinks, cold plates, fans or other thermal management components to achieve the required cooling performance.
For projects requiring specific operating conditions, customers can provide requirements such as:
Based on these requirements, a suitable custom micro thermoelectric cooler can be evaluated.
The 35x76x4.2mm High Temperature Peltier Cooler is a compact thermoelectric cooling module based on the Peltier effect.
With a 35 × 76 mm size and 4.2 mm thickness, the module is designed for equipment requiring compact thermal management and temperature control.
As a micro thermoelectric cooler, it can be integrated into various electronic and precision equipment where traditional refrigeration systems may be difficult to install.
The module transfers heat from one side to the other when DC power is applied, providing a convenient solid-state solution for localized cooling and temperature regulation.
It can be used in electronics cooling, optical equipment, laser-related thermal management, semiconductor equipment and other compact temperature-control systems.
The relatively compact footprint makes the module suitable for applications with limited installation space.
The 4.2 mm thickness helps simplify integration into compact thermal management systems.
The module uses thermoelectric technology for solid-state cooling without conventional compressors or refrigerants.
The micro thermoelectric cooler can be used for localized cooling and temperature stabilization.
The module can be integrated with heat sinks, cold plates and other thermal management components.
Customized micro thermoelectric cooling modules can be evaluated according to dimensions, electrical requirements and application conditions.
Its small form factor makes it suitable for compact electronic and precision equipment.
The 35x76x4.2mm High Temperature Peltier Cooler can be used in a variety of compact thermal management applications.
Used as a micro thermoelectric cooler for electronics cooling in compact electronic equipment and localized thermal management systems.
A micro Peltier cooler for laser cooling can help provide localized temperature control for laser-related equipment.
The module can be integrated into semiconductor equipment requiring precise localized thermal management.
The micro Peltier cooler for optical cooling can be used in optical and optoelectronic equipment where temperature stability is important.
Compact thermoelectric cooling modules can be integrated into selected medical and analytical equipment for localized temperature control.
The compact form factor makes a micro thermoelectric cooler for portable cooling suitable for selected portable thermal management applications.
The module can also be considered for micro thermoelectric cooler for small electronic devices where installation space is limited.

The 35x76x4.2mm High Temperature Peltier Cooler operates based on the Peltier effect.
When direct current passes through the thermoelectric semiconductor elements, heat is absorbed on one side of the module and released on the opposite side.
This creates:
Cold Side → Heat Transfer → Hot Side
The cold side can be connected to the target component requiring cooling, while the hot side normally needs to be connected to an appropriate heat dissipation system.
The overall cooling effect depends not only on the Micro Thermoelectric Cooler itself, but also on the heat load, power input and hot-side heat dissipation capability.
Therefore, proper heat sink or cooling system selection is important when designing a complete thermoelectric cooling system.
A Micro Thermoelectric Cooler is a compact thermoelectric cooling module that uses the Peltier effect to transfer heat from one side to another when DC power is applied. It is commonly used for localized cooling and temperature control.
This model has a nominal size of 35 × 76 mm with a thickness of 4.2 mm.
Yes. This product is positioned as a 35x76x4.2mm High Temperature Peltier Cooler. The actual allowable operating temperature should be confirmed according to the product specification and application conditions.
It can be considered for electronics cooling, laser cooling, semiconductor temperature control, optical equipment, medical devices, portable cooling equipment and other compact thermal management applications.
Yes. OEM and custom micro thermoelectric cooler solutions can be evaluated according to dimensions, electrical requirements, operating temperature and application conditions.
It can be considered for laser thermal management applications. The appropriate model should be selected according to the laser's heat load, temperature requirements and installation conditions.
A thermoelectric cooler has no compressor or refrigerant and can provide localized solid-state cooling. This makes it suitable for compact equipment and applications requiring a relatively simple cooling structure.
The main factors include cooling capacity, temperature difference, operating temperature, voltage, current, module dimensions, heat dissipation conditions and installation space. For engineering applications, the complete thermal system should be considered rather than selecting the module based only on size.
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