🔷Thermoelectric Cooling Element Basic Performance Spec  

🔷Thermoelectric Cooling Device Additional Performance Spec

🔷Thermoelectric Generator Modules Product Drawing

🔷Thermoelectric Generator Modules Product Drawing

🔷Peltier Cooling Element Product Overview Peltier

The TEC1-24108 is a high-power single-stage thermoelectric cooler (TEC) with a standard dimension of 50×50 mm, designed for industrial precision temperature control. Utilizing the Peltier effect, this solid-state thermoelectric module achieves active cooling, heating, and precise constant temperature regulation without compressors, refrigerants, or moving mechanical parts. Featuring large heat exchange area, high cooling capacity, excellent temperature difference performance, and long-term operational stability, the TEC1-24108 is widely adopted in industrial equipment, analytical instruments, medical devices, optoelectronic systems, and commercial thermostat applications. All products are manufactured in compliance with international industrial standards and environmental regulations, providing a reliable, energy-saving, and eco-friendly temperature control solution for high-precision thermal management systems.

1. Product Model Definition

The model code of TEC1-24108 represents standardized structural and electrical specifications, ensuring clear industry classification and universal customer selection:

• TEC1: Single-stage thermoelectric cooling module, featuring balanced efficiency, compact structure, and wide adaptability for conventional temperature difference control scenarios.
• 241: Equipped with 241 pairs of high-precision bismuth telluride P/N thermocouples, forming a high-density thermoelectric array to deliver superior cooling power and temperature conversion efficiency.
• 08: Rated maximum operating current of 8.5A, supporting stable DC power supply and continuous heavy-load operation.
• 50×50mm: Large-format planar size, providing a larger heat exchange area to optimize thermal conduction uniformity and improve overall heat dissipation efficiency.

2. Core Technical Specifications

All parameters are calibrated under standard ambient temperature (27℃) with strict batch consistency, meeting industrial-grade performance requirements:

• Overall Dimension: 50×50×4.0 mm
• Max Operating Current (Imax): 8.5 A
• Max Operating Voltage (Umax): 29.2 V
• Max Cooling Capacity (Qc max): 143.4 W (at ΔT = 0K)
• Max Temperature Difference (ΔT max): ≥66 K (at zero load)
• Internal Resistance Tolerance: ±5% batch consistency
• Maximum Working Temperature: 125℃ (standard industrial grade)
• MTBF: ≥100,000 hours for continuous operation

3. Structural Design & Manufacturing Technology

The TEC1-24108 adopts industrial-grade high-precision packaging technology with premium materials to ensure thermal conductivity, electrical insulation, and structural durability:

High-efficiency Thermoelectric Material: Adopts high-purity bismuth telluride ceramic thermoelectric material with optimized sintering formula, delivering high thermoelectric conversion efficiency, fast temperature response, and stable thermal cycle performance without obvious performance attenuation after long-term operation.

DBC Ceramic Substrate: Double-sided direct bonded copper (DBC) ceramic substrate provides ultra-high thermal conductivity and excellent electrical insulation, effectively preventing electric leakage and short-circuit risks while minimizing thermal resistance for rapid heat transfer.

Sealed & Reinforced Packaging: Adopts high-temperature resistant solder and industrial silicone edge sealing technology, realizing dustproof, moisture-proof, and anti-oxidation performance. The precisely polished flat surface ensures tight fitting with heat sinks and heat sources, greatly reducing contact thermal resistance.

Durable Lead Wire: Equipped with high-temperature resistant stranded wires with stable conductivity, anti-aging performance, and strong adaptability for long-term continuous power-on operation.

4. Key Product Advantages

• Zero Noise & Vibration-Free Operation: Fully solid-state structure without moving components, enabling silent and vibration-free operation, ideal for laboratory, optical, and precision testing environments.
• Reversible Cooling & Heating: Realizes rapid switching between cooling and heating modes by reversing DC polarity, supporting precise and dynamic temperature adjustment with control accuracy up to ±0.1℃.
• High Power & Uniform Heat Exchange: 50×50 mm large heat exchange surface and 241 pairs of thermocouples ensure sufficient cooling output and uniform temperature distribution, solving local overheating problems of small-size TEC modules.
• Strong Environmental Adaptability: Excellent resistance to high-low temperature impact, humidity aging, and complex industrial working conditions, maintaining stable performance in variable ambient environments.
• Eco-Friendly & Green: No refrigerant, no pollution, no exhaust gas or waste liquid emission, fully compliant with global environmental protection standards.

5. Compliance & Quality Assurance

The TEC1-24108 series thermoelectric coolers are manufactured under standardized industrial quality control systems, with full-process inspection from raw material incoming check to finished product delivery. All products comply with RoHS environmental protection directives and international electronic safety standards. Each batch undergoes strict tests including electrical performance testing, temperature difference calibration, insulation resistance testing, high-low temperature cycling, and long-term aging testing to ensure stable consistency, high reliability, and qualified industrial-grade durability. The module features low failure rate and long service life, supporting 24/7 continuous industrial operation.

🔷 Product Applications

The TEC1-24108 50×50mm thermoelectric cooler is a high-power, large-area single-stage Peltier module designed for medium and high-load precision thermal management. Featuring large cooling capacity, high maximum temperature difference, stable continuous operation, and reversible cooling/heating function, this TEC module is widely deployed in industrial, commercial, medical, laboratory, and optoelectronic fields. It is especially suitable for scenarios requiring compact structure, silent operation, zero refrigerant, and accurate closed-loop temperature control. Below are its standardized and mature application fields.

1. Laboratory & Analytical Instrumentation

Precision laboratory equipment requires stable and consistent temperature environments to ensure accurate test data. The TEC1-24108 provides high-precision constant temperature control with rapid temperature response and low temperature fluctuation. It is commonly applied in biochemical analyzers, spectroscopic instruments, constant-temperature test chambers, sample storage thermostats, and environmental monitoring devices. Its vibration-free and noise-free performance avoids interference with high-precision detection and sensing components, improving experimental repeatability and data stability.

2. Optoelectronic & Laser Equipment

Laser modules, optical sensors, and imaging devices are extremely sensitive to temperature drift. Even minor temperature changes can cause wavelength shift, power attenuation, and reduced imaging quality. The TEC1-24108 high-power TEC cooler delivers efficient heat dissipation and constant-temperature locking for laser generators, infrared detectors, optical communication transceivers, and industrial vision systems. The 50×50mm large contact area ensures uniform heat transfer, effectively eliminating local hot spots and maintaining long-term stability of optoelectronic devices during continuous operation.

3. Medical & Aesthetic Equipment

In medical and commercial aesthetic devices, safe, stable, and controllable temperature adjustment is essential. The TEC1-24108 supports fast cooling and precise temperature holding, making it ideal for medical constant-temperature diagnostic modules, low-temperature sample preservation equipment, skin cold therapy instruments, facial cooling beauty devices, and physical therapy temperature-control systems. With solid-state safety design, no liquid refrigerant, and compliant environmental performance, it fully meets medical-grade safety and hygiene requirements for commercial and clinical use.

4. Industrial Equipment & Enclosure Thermal Management

Industrial electronic equipment generates continuous heat during long-term operation, which may lead to performance degradation and shortened service life. The TEC1-24108 is widely used for industrial cabinet cooling, electrical enclosure temperature control, industrial dehumidifiers, and automated equipment heat dissipation systems. Its high power-bearing capacity supports 24-hour uninterrupted operation under complex industrial conditions, effectively reducing internal ambient temperature, preventing circuit overheating, and improving the overall operational reliability of industrial systems.

5. Commercial Refrigeration & Constant-Temperature Systems

For small and medium-sized commercial thermostat devices that require compact size and low noise, the TEC1-24108 serves as an ideal solid-state cooling core. Typical applications include mini constant-temperature refrigerators, commercial insulation cabinets, beverage constant-temperature equipment, and portable temperature-control cabinets. Different from traditional compressor cooling systems, the TEC solution features no mechanical vibration, low failure rate, and flexible installation, adapting to diversified commercial lightweight refrigeration demands.

6. Special Industrial & New Energy Temperature Control

In special industrial scenarios where traditional cooling structures are difficult to deploy, the TEC1-24108 provides flexible and reliable thermal management solutions. It is widely used for new energy component temperature stabilization, automotive auxiliary temperature-control modules, environmental monitoring station constant-temperature systems, and precision electronic component heat dissipation. The reversible cooling and heating function enables active temperature compensation in high and low temperature environments, ensuring equipment works within a rated temperature range under extreme ambient conditions.

7. Application Advantages in System Integration

Compared with conventional small-size TEC modules, the 50×50mm large-area TEC1-24108 presents obvious integration advantages: higher cooling power to handle high heat flux equipment, more uniform surface temperature to avoid local thermal stress, stronger continuous load capacity to adapt to long-term industrial operation, and reversible temperature regulation to meet both cooling and heating demands. It is highly compatible with standard heat sinks, temperature controllers, and thermal conductive silicone accessories, facilitating rapid mass integration and standardized batch production.

🔷Product Structure

The TEC1-24108 50×50mm thermoelectric cooler is a high-power single-stage solid-state Peltier module with a multi-layer composite symmetrical structure. Adopting industrial-grade DBC ceramic substrate, high-density thermoelectric grain array and high-reliability sealing packaging, the product features high structural flatness, ultra-low internal thermal resistance, excellent electrical insulation and strong mechanical stability. Its standardized layered structure ensures efficient thermoelectric conversion, uniform heat conduction and long-term structural reliability for continuous industrial operation.

1. Overall Structural Layout

The module adopts a symmetrical upper and lower double-layer flat structure with an overall dimension of 50×50×4.0mm. The whole structure is composed of upper ceramic substrate, conductive copper electrode layer, thermoelectric grain array, welding layer, lower ceramic substrate and edge sealing protection layer. The compact and highly integrated structural design eliminates internal hollow gaps, ensures uniform stress distribution, and effectively avoids deformation, delamination and thermal fatigue failure during long-term cold and hot cycling.

2. DBC Ceramic Substrate Layer

Both the cold side and hot side adopt high-performance DBC (Direct Bonded Copper) alumina ceramic substrates, which serve as the core supporting and heat conducting structure of the TEC module. The DBC substrate integrates high thermal conductivity, excellent electrical insulation and high mechanical strength. It can rapidly transfer heat from the contact surface to the internal thermoelectric grains while completely isolating the external heat dissipation structure from the internal circuit, effectively preventing electric leakage, short circuit and breakdown risks. The substrate surface is precisely polished to ensure ultra-high flatness, greatly reducing contact thermal resistance during system assembly.

3. Precision Copper Electrode Circuit Layer

High-purity oxygen-free copper conductive layers are firmly bonded on the inner side of the upper and lower ceramic substrates. Through precise etching and forming process, independent electrode circuits are formed to realize series connection of internal thermoelectric grains. The copper electrode features low resistivity, strong current carrying capacity and excellent solderability, which can stably bear the rated working current of 8.5A for a long time. The uniform circuit distribution ensures consistent current transmission of each thermoelectric pair and avoids local overheating caused by unbalanced current.

4. High-Density Thermoelectric Grain Array Core

The core functional layer consists of 241 pairs of high-purity bismuth telluride N-type and P-type thermoelectric grains, arranged in a dense and orderly array. This high-density grain layout is the key support for the module’s high cooling power and large temperature difference. All thermoelectric grains adopt high-precision cutting and screening processes with consistent grain size and performance parameters. Through scientific alternating arrangement of P/N pairs, the module realizes efficient Peltier effect conversion, ensuring stable cooling capacity and excellent temperature difference performance under rated working conditions.

5. High-Reliability Welding Layer

Environmentally friendly high-temperature solder is used for welding between thermoelectric grains and copper electrodes. The welding layer features uniform thickness, high bonding strength and excellent thermal conductivity. It effectively connects the thermoelectric grains with the conductive circuit to form a complete thermoelectric conduction loop. The optimized welding process eliminates virtual welding, missing welding and bubble defects, reduces internal thermal resistance, and improves the structural anti-fatigue ability during frequent temperature cycling.

6. Edge Sealing & Protective Structure

The periphery of the module is filled and sealed with high-elasticity industrial-grade silicone sealing glue. The edge sealing structure fully covers the internal grain array and welding gaps, forming an all-round protective barrier. This structure effectively prevents moisture, dust and corrosive gas from penetrating into the interior, avoids oxidation and mildew of internal electrodes and grains, and significantly improves the module’s environmental adaptability and service life. The sealing material features high and low temperature resistance, no aging and no cracking under long-term temperature impact.

7. Lead Wire Connection Structure

The module is equipped with high-temperature resistant flexible lead wires, which are firmly welded to the reserved electrode terminals. The lead wire structure has stable conductivity, strong tensile resistance and excellent aging resistance. It supports long-term continuous power-on operation and frequent cold-hot switching without open circuit or poor contact. The standard lead-out design is convenient for customer wiring and system integration, compatible with various industrial temperature control drivers and power supply modules.

8. Structural Performance Advantages

• Uniform Heat Conduction Structure: 50×50mm large-area flat structure realizes overall balanced heat transfer, eliminates local hot spots, and improves temperature control uniformity.
• High Insulation & Safety Structure: Double-layer DBC ceramic isolation structure ensures high dielectric strength and completely isolates electricity and heat.
• Anti-Fatigue & Durable Structure: Optimized welding and integral sealing process resists thermal expansion and contraction stress, adapting to long-term cyclic temperature changes.
• Standardized Assembly Structure: Strict dimensional tolerance and high flatness design support seamless fitting with heat sinks, thermal conductive materials and equipment fixtures.

🔷 Operation Principle

The TEC1-24108 50×50mm thermoelectric cooler operates based on the fundamental physical Peltier Effect, realizing active cooling, heating, and precise temperature control through solid-state thermoelectric energy conversion. As a high-power single-stage thermoelectric module, it converts electrical energy directly into thermal energy transfer without any mechanical moving parts, compressors, or refrigerant media. This pure electronic thermal control mechanism enables fast response, reversible temperature regulation, and highly stable continuous operation for industrial and precision thermal management systems.

1. Core Thermoelectric Conversion Theory (Peltier Effect)

When a direct current (DC) passes through the series-connected P-type and N-type bismuth telluride thermoelectric pairs inside the TEC module, directional heat transfer occurs at the semiconductor junction interface. Depending on the current direction, one side of the module absorbs heat and forms a cold surface, while the opposite side releases heat and forms a hot surface. The TEC1-24108 contains 241 pairs of high-performance P/N thermoelectric grains arranged in a dense array, which greatly enhances heat transfer efficiency and provides the module with high cooling capacity and large temperature difference performance under rated current and voltage conditions.

2. Unidirectional Cooling Operating Mechanism

Under forward DC power supply, the TEC1-24108 performs standard active cooling function. Heat is continuously extracted from the cold-side ceramic substrate and transferred rapidly to the hot-side substrate through internal thermoelectric grains. The 50×50mm large-area flat structure ensures uniform heat absorption across the entire cold surface, avoiding local temperature deviation. The accumulated heat on the hot side must be dissipated timely through matched heat sinks, cooling fans, or liquid cooling modules to maintain effective temperature difference and stable cooling efficiency. With rated current input, the module can achieve a maximum temperature difference above 66K and provide continuous high-power cooling output for heat-generating equipment.

3. Reversible Heating Function Principle

A unique advantage of the TEC thermoelectric module is bidirectional temperature adjustment. By reversing the DC current polarity, the heat transfer direction is inverted instantly. The original cold side becomes the heat release surface, while the original hot side becomes the heat absorption surface. This working principle allows the TEC1-24108 to switch freely between cooling and heating modes within seconds, realizing precise temperature compensation and constant-temperature locking. This reversible working characteristic makes the module suitable for high-precision constant-temperature systems that require both overheating cooling and low-temperature heating compensation.

4. Thermal Balance & Temperature Stabilization Mechanism

In practical closed-loop temperature control systems, the TEC1-24108 works cooperatively with temperature sensors and professional TEC drivers. The real-time temperature data feedback adjusts the operating current and power dynamically, forming a precise thermal balance loop. When the load temperature is higher than the set value, the module increases cooling power rapidly; when the temperature reaches the target, the operating power is reduced to maintain micro-balance; when the ambient temperature fluctuates, the system actively compensates temperature deviation. This intelligent adjustment principle enables the module to achieve high-precision temperature control accuracy up to ±0.1℃.

5. Internal Current & Heat Transfer Logic

All 241 pairs of P/N thermoelectric grains inside the TEC1-24108 are connected in series through high-precision copper electrode circuits. After DC power is applied, current flows evenly through each thermoelectric unit, ensuring consistent thermoelectric conversion efficiency of the entire array. The DBC ceramic substrates on both sides act as high-speed thermal conduction and electrical isolation layers, ensuring that heat transfer is concentrated on the planar direction while avoiding current leakage and electrical breakdown. The uniform current distribution and low thermal resistance structure eliminate unbalanced heat transfer, ensuring stable and reliable long-term operation of the module.

6. Operating Limit Principle & Protection Logic

The maximum cooling capacity and maximum temperature difference of the TEC1-24108 follow professional thermoelectric operating rules. The maximum temperature difference is achieved under no-load condition, while the maximum cooling power is realized at zero temperature difference. In actual application, reasonable heat dissipation on the hot side is the core premise to ensure normal operation. Insufficient heat dissipation will cause hot-side heat accumulation, reduce temperature difference performance, and even trigger overheating failure. With standardized power supply and complete heat dissipation configuration, the module can maintain long-term stable thermoelectric conversion and realize continuous 24-hour industrial operation.

7. Working Principle Advantages

• Zero Mechanical Loss Operation: Solid-state electronic heat conversion principle without moving parts, realizing zero noise and zero vibration operation.
• Fast Dynamic Response: Electric-thermal conversion completes instantly, supporting rapid temperature rise and fall adjustment.
• Dual-Circuit Cooling & Heating: Polarity reversal controls heat transfer direction to meet diversified temperature regulation demands.
• High-Precision Constant Temperature: Cooperates with closed-loop control to realize ultra-stable temperature locking.
• Environmentally Friendly Operation: Pure electric thermal control principle requires no refrigerant, fully compliant with global environmental protection standards.