🔷Peltier Device Product Drawing

🔷Thermoelectric Module Basic Performance Spec

🔷Thermoelectric Peltier Additional Performance Spec

🔷TEG Module Performance Curve

🔷Solid State Cooler Product Overview

The TEC1-06301 is a semiconductor cooling module designed for large-area, low-power, high-voltage precision temperature control. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. It is optimized for compact devices—such as laser modules, medical and cosmetic equipment, analytical instruments, and communications equipment—that require large-area temperature control but have limited power budgets.

This product is available in three crystal configurations—K28, K34, and K40—with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 7.6 V, a maximum current of 1.4 A, a maximum cooling power of 11 W, and an internal resistance of 4.23 Ω.

The 20×40 mm rectangular package allows it to be embedded inside devices such as laser modules, medical probes, and analytical instruments—while ensuring a maximum cooling temperature difference of 70°C and a cooling power of 11 W, the 20 mm width and 40 mm length provide ample heat exchange area, helping to evenly transfer cooling capacity to large-area load surfaces. The core advantage of this product lies in its drive design featuring a relatively high voltage of 7.6V and a low current of 1.4A, which is highly compatible with common two-cell lithium-ion battery series-connected power supply platforms (7.4V), eliminating the need for complex power conversion. The combination of high voltage and low current minimizes circuit losses, making it suitable for long-distance lead wiring and distributed temperature control systems. The high internal resistance of 4.23Ω ensures precise current control at low currents, enabling the drive circuit to achieve high-precision constant-current regulation and thereby deliver stable temperature control. The substrate is manufactured using a sintering process that combines 96% alumina ceramic (0.76mm) with 0.4mm oxygen-free copper; the relatively thick copper layer ensures uniform heat diffusion across the large 40mm × 20mm surface area, preventing localized hot spots. It comes standard with extra-soft 24 AWG silicone rubber leads (100 mm in length), which are flexible and facilitate internal wiring within large-area equipment. Sealed with 704 silicone rubber around the perimeter, it is fully solid-state, noise-free, and vibration-free, ensuring stable and reliable operation.

This product is typically used in applications such as temperature control for laser modules, hot and cold probes for medical and cosmetic devices, temperature stabilization for analytical instruments, heat dissipation for telecommunications equipment, and laboratory equipment. It is an ideal choice for low-power, high-precision temperature control requirements in large-area spaces.

🔷Thermoelectric Power Generator Product Applications

1. Temperature Control for Laser Modules

Semiconductor laser modules are temperature-sensitive during operation; a temperature fluctuation of 1°C can cause a wavelength drift of approximately 0.3 nm. The TEC1-06301’s 20×40 mm dimensions are compatible with standard laser module packaging, and its low power consumption of 11 W makes it suitable for portable laser devices with power consumption constraints, ensuring stable output wavelength and power.

2. Cold/Hot Therapy Probes for Beauty Devices

Cold and hot therapy probes for home-use and professional beauty devices (such as photorejuvenation devices and cryolipolysis hair removal devices) typically feature a large contact surface. The TEC1-06301 enables alternating cold and hot modes by switching the current direction, and its large 20×40 mm surface area provides greater contact coverage, enhancing the user experience and treatment effectiveness.

3. Temperature Control for Analytical Instruments

Detectors in scientific instruments such as spectrophotometers, chromatographs, and thermal analyzers must operate under constant-temperature conditions to reduce dark current and improve the signal-to-noise ratio. The TEC1-06301 provides a stable, constant-temperature environment; its large coverage area effectively ensures temperature consistency across all regions of the detector, and its vibration-free, noise-free solid-state operation is well-suited for noise-sensitive laboratory environments.

4. Temperature Control for Communication Equipment

Critical chips in equipment such as communication base stations and optical modules generate concentrated heat during operation. The TEC1-06301 can be used for active cooling of these critical components; its 7.6V operating voltage is compatible with common power supply platforms for communication equipment, and its 20×40mm surface area can cover large heat-generating areas.

5. Temperature Control for Medical Diagnostic Equipment

Reaction modules in medical devices such as in vitro diagnostic (IVD) equipment and chemiluminescence analyzers require a strictly controlled, constant-temperature environment. With its compact size, maintenance-free operation, and stable performance, the TEC1-06301 meets the long-term reliability requirements of medical equipment. A high assembly pressure of 2.0 kg ensures a tight bond between the large-area cooling plate and the heat sink, enhancing the stability of temperature control in medical devices.

6. Laboratory Equipment and Research/Education

In experimental teaching for university programs in physics, materials science, and electrical engineering, the TEC1-06301 can be used for educational experiments such as demonstrating the Peltier effect, the principles of thermoelectric cooling, and heat pump performance testing. Its large surface area facilitates student observation and measurement.

🔷Element Peltier Operation Principle

TEC1-06301 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 63 pairs of semiconductor grains (the “063” in the model number denotes 63 pairs), representing a medium-scale thermoelectric stack design. With a relatively large number of thermocouple pairs, it can generate a greater temperature difference and cooling capacity at the same current. The 0.4 mm-thick oxygen-free copper layer ensures uniform heat dissipation across the large 40 mm × 20 mm surface area.

When a forward DC voltage (up to 7.6 V) is applied, a 1.4 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As the charge carriers cross the PN junction interface, the cold junction absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot junction releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.

The core advantage of this product lies in its drive design featuring a relatively high voltage of 7.6V and a low current of 1.4A. The 7.6V voltage is highly compatible with the common power supply configuration of two lithium batteries connected in series (7.4V), eliminating the need for additional step-up or step-down circuits and simplifying system power supply design. At the same time, the combination of high voltage and low current minimizes line losses (I²R), making it particularly suitable for applications requiring long-distance wiring. The high internal resistance of 4.23 Ω facilitates precise control of the 1.4 A current at 7.6 V, reduces the precision requirements for the drive circuit, and facilitates high-precision constant-current control. The 0.4 mm thick copper layer helps heat from the hot end dissipate evenly across the large 40 mm × 20 mm surface area, preventing localized overheating and improving heat dissipation efficiency.

This product achieves a maximum temperature difference of 70°C at a hot-end temperature of 40°C (K40 model), meaning the cold end can reach as low as approximately -30°C. Achieving this level of cooling at a low input power of 11 W demonstrates excellent energy efficiency. The large 20 × 40 mm footprint allows it to fit snugly against medium-to-large-sized loads, such as laser modules and analytical instruments. The large contact area and short heat transfer path effectively reduce the contact thermal resistance between the cold end and the load.