🔷Peltier Cooling Element Product Drawing

🔷TEC Cooling System Basic Performance Spec

🔷Thermoelectric Cooling Device Additional Performance Spec

🔷Thermoelectric Cooling Element Performance Curve

🔷Thermoelectric Generation Product Overview

The TEC1-06302 is a semiconductor cooling module designed for large-area, medium-power precision temperature control. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. It is optimized for compact devices requiring large-area temperature control and moderate power, such as laser modules, medical and cosmetic equipment, analytical instruments, and communications equipment.

This product is available in three crystal configurations—K18, K28, and K38—with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 7.6V, a maximum current of 2.2A, a maximum cooling power of 17W, and an internal resistance of 2.69Ω.

The 20×40 mm rectangular package allows it to be embedded inside devices such as laser modules, medical probes, and analytical instruments—while ensuring a maximum cooling temperature difference of 70°C and a cooling power of 17 W, the 20 mm width and 40 mm length provide ample heat exchange area, helping to evenly transfer cooling capacity to large-area load surfaces. This product is designed to operate at 7.6V and 2.2A, making it highly compatible with common two-cell lithium-ion battery series power supply platforms (7.4V) without the need for complex power conversion. The 2.69Ω internal resistance provides moderate current control sensitivity, facilitating precise constant-current regulation by the drive circuit. The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the large 40 mm × 20 mm surface area, preventing localized hot spots. It comes standard with extra-soft 24 AWG silicone rubber leads (100 mm in length), which are flexible and facilitate internal wiring within large-area equipment. Sealed with 704 silicone rubber around the perimeter, it is fully solid-state, noise-free, and vibration-free, ensuring stable and reliable operation.

This product is typically used in applications such as temperature control for laser modules, hot and cold probes for medical and cosmetic devices, temperature stabilization for analytical instruments, PCR temperature control modules, heat dissipation for telecommunications equipment, and industrial laser processing. It is an ideal choice for precision temperature control requirements involving medium power and large-area spaces.

🔷Thermoelectric Generator Modules Product Features

1. Large-area symmetrical design with ample heat exchange surface area

The 20×40 mm rectangular package provides a large heat exchange surface area, facilitating uniform heat transfer to the surface of large-area loads, making it suitable for medium-to-large-sized temperature-controlled equipment.

2. Ample cooling capacity for medium-power applications

With a maximum current of 2.2 A and a maximum power of 17 W, it delivers ample cooling capacity within its large-area package, making it suitable for compact devices with moderate thermal loads.

3. Deep cooling capability, large surface area and high temperature difference

At 17 W, it achieves a maximum temperature difference of 70°C, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep cooling.

4. Three Crystal Options for Flexible Adaptation

Three crystal configurations are available: K18 (60°C), K28 (65°C), and K38 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.

5. Three Thickness Options to Suit Different Spaces

Thicknesses are 4.2 mm, 5.2 mm, and 6.2 mm. the K38 model, at 6.2 mm thick, provides ample space for the crystal grains to facilitate large-area cooling, helping to achieve deep cooling down to 70°C.

6. Excellent Power Supply Compatibility

With a maximum voltage of 7.6V, it is highly compatible with power platforms using two lithium batteries connected in series (7.4V). No complex power conversion is required, allowing for direct integration into common portable device power architectures.

7. High-Quality Substrate for Uniform Heat Dissipation Across a Large Area

The substrate is manufactured using a sintering process combining 96% aluminum oxide ceramic (0.76 mm) and oxygen-free copper (0.4 mm). The relatively thick copper layer ensures that heat is evenly distributed and rapidly dissipated across the 40 mm × 20 mm surface area.

8. Extra-Soft Leads for Easy Wiring in Large-Area Devices

Comes standard with extra-soft 24 AWG silicone-coated wires (100 mm in length). The flexible wires facilitate flexible routing inside large-area devices, reducing assembly difficulty.

9. High Adaptability to Assembly Pressure

The recommended assembly pressure is 2.0 kg (0.25 kg/cm²), ensuring that the large-area cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance.

10. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling operation in complex environments with high humidity and significant temperature fluctuations.

11. Bidirectional Temperature Control, Dual-Function Single Core

Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature-control systems requiring bidirectional temperature regulation.

12. Zero Noise, Zero Vibration, Precision Operation

With an all-solid-state design, it operates completely silently and with zero vibration, making it ideal for high-precision applications with strict noise and vibration requirements.

🔷Thermo Cooler Installation and Usage Recommendations

Assembly Pressure: 2.0 kg (0.25 kg/cm²) is recommended. Large-area cooling plates require higher assembly pressure to ensure a tight fit with the heat sink and the surface being cooled, effectively reducing thermal contact resistance. It is recommended to apply thermal grease (thermal conductivity > 3 W/m·K) evenly to both surfaces, with a thickness of 0.05–0.1 mm.

Installation Orientation: The 20×40 mm rectangular TEC has a defined dimensional orientation. During installation, ensure that the 40 mm long side aligns with the length of the device being cooled to achieve optimal thermal contact coverage.

Hot-end Cooling Requirements: With a moderate power dissipation of 17 W, we recommend using an extruded aluminum heat sink measuring at least 25 × 45 × 15 mm, paired with a low-speed fan (airflow > 5 CFM) or cooling via the device’s metal enclosure to meet the requirements.

Power Supply Requirements: Maximum voltage 7.6 V, maximum current 2.2 A. It is recommended to use two lithium-ion batteries connected in series (7.4V; ensure the batteries have a discharge capacity of ≥2.5A) or a regulated power supply rated at 7.6V/2.5A or higher. The power supply ripple should be < 50mV.

Lead Wires: The standard configuration includes extra-flexible 24 AWG silicone-coated wires, which fully meet the 2.2A requirement; the flexible wires facilitate routing within the interior of large-area equipment.

Current Limit: Do not exceed 2.2A. It is recommended to connect a 2.5A self-resetting fuse in series for overcurrent protection.

Condensation Prevention Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation, and coat the lead solder joints with conformal coating.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.

Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.