The TEC1-06304 is a flagship semiconductor cooling module designed for large-area, high-power, high-density cooling. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. It is specifically optimized for compact devices requiring large-area temperature control and high thermal loads, such as high-power laser modules, industrial laser processing equipment, high-performance analytical instruments, high-power communication devices, and other compact equipment requiring large-area temperature control and capable of handling high thermal loads. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🔷Peltier Heater Product Drawing

🔷TEC Peltier Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-06304 | K10 | 60 | 1.48 | 7.6 | 3.0 | 30 | 20×40×3.4 |
| TEC1-06304 | K18 | 65 | 1.48 | 7.6 | 3.0 | 30 | 20×40×4.2 |
| TEC1-06304 | K26 | 70 | 1.48 | 7.6 | 3.0 | 30 | 20×40×5.0 |
🔷TEC Module Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 24 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 2.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermoelectric Cooler Module Performance Curve

🔷Thermoelectric Peltier Module Product Overview
The TEC1-06304 is a flagship semiconductor cooling module designed for large-area, high-power, high-density cooling. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. It is specifically optimized for compact devices requiring large-area temperature control and high thermal loads, such as high-power laser modules, industrial laser processing equipment, high-performance analytical instruments, high-power communication devices, and other compact equipment requiring large-area temperature control and capable of handling high thermal loads.
This product is available in three crystal configurations—K10, K18, and K26—with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 7.6 V, a maximum current of 3.0 A, a maximum cooling power of 30 W, and an internal resistance of just 1.48 Ω.
The large 20×40mm rectangular package allows it to be embedded within high-power laser modules, medical and cosmetic devices, and industrial equipment—while ensuring a maximum cooling temperature difference of 70°C and high-power cooling of 30W, the 20mm width and 40mm length provide ample heat exchange area, helping to evenly transfer cooling capacity to large-area, high-heat-load surfaces. The product is designed to operate at 7.6V and 3.0A, making it highly compatible with common two-cell lithium-ion battery series power supply platforms (7.4V) without the need for complex power conversion. The ultra-low internal resistance of 1.48Ω effectively controls Joule heating loss (I²R ≈ 13.3W) at a current of 3.0A, allowing more electrical energy to be converted into effective cooling capacity rather than self-generated heat, resulting in outstanding energy efficiency. The substrate is manufactured using a sintering process that combines 96% alumina ceramic (0.76 mm) with 0.4 mm oxygen-free copper. The relatively thick copper layer ensures rapid and uniform heat dissipation across the large 40 mm × 20 mm surface area, preventing localized overheating. It comes standard with 24 AWG silicone-coated leads capable of safely carrying a 3.0 A current. Sealed with 704 silicone rubber around the perimeter, it operates in a fully solid-state, noise-free, and vibration-free manner, ensuring stable and reliable performance.
This product is typically used in applications such as temperature control for high-power laser modules, industrial laser processing equipment, temperature stabilization for high-performance analytical instruments, heat dissipation for high-power communication components, medical diagnostic equipment, and industrial sensors. It is the flagship choice for high-power, high-density cooling requirements in large-area applications.
🔷Cooling Module Product Applications
1. Temperature Control for High-Power Laser Modules
High-power semiconductor laser modules generate significant heat during operation, and temperature fluctuations directly affect the stability of output wavelength and power. The TEC1-06304’s 30W high-power cooling capacity enables efficient temperature control on the surface of a 20×40mm module, stabilizing the laser temperature within ±0.05°C of the setpoint. It is suitable for industrial laser processing, optical communications, and LIDAR systems.
2. Temperature Control for Industrial Laser Processing Equipment
Optical components in industrial laser processing equipment are subject to thermal deformation during operation, which affects processing accuracy. The TEC1-06304 provides active temperature control; its 30W high-power cooling capacity effectively manages the heat generated during high-power laser processing, maintaining a constant temperature for optical components and ensuring processing accuracy.
3. Temperature Control for High-Performance Analytical Instruments
Detectors in high-end scientific instruments—such as spectrophotometers, chromatographs, and thermal analyzers—generate significant heat during operation and must operate under constant-temperature conditions to reduce dark current and improve the signal-to-noise ratio. The TEC1-06304’s 30W power effectively dissipates the heat generated by the detector, while its large coverage area ensures temperature consistency across all regions of the detector.
4. Heat Dissipation for High-Power Communication Components
High-power communication components—such as communication base stations, RF power amplifier modules, and 5G communication equipment—generate concentrated heat during operation. The TEC1-06304 can be used for active cooling of critical components; its 30W power output provides robust cooling capacity, and its 20×40mm surface area covers large heat-generating areas.
5. Temperature Control for Medical Diagnostic Equipment
Reaction modules in medical devices—such as in vitro diagnostic (IVD) equipment, chemiluminescence analyzers, and large medical imaging systems—require a strictly controlled, constant-temperature environment. With its moderate size, maintenance-free operation, and stable performance, the TEC1-06304 meets the long-term reliability requirements of medical equipment. A high assembly pressure of 2.0 kg ensures a tight bond between the large-area cooling plate and the heat sink, enhancing the stability of temperature control in medical devices.
6. Temperature Control for High-Performance Sensors
High-end industrial sensors and infrared sensor arrays generate significant heat during operation, and temperature drift can affect detection accuracy. The TEC1-06304’s 30W power rating effectively dissipates the heat generated by the sensors, providing uniform cooling across the entire surface of the sensor’s rear side to eliminate temperature gradients and ensure detection accuracy.
🔷Tec Thermoelectric Cooler Product Show



The TEC1-06308 is a flagship semiconductor cooling module designed for large-area, extreme high-power-density cooling. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-06308 is a flagship semiconductor cooling module designed for large-area, extreme high-power-density cooling. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-06306 is a flagship semiconductor cooling module designed for large-area, ultra-high-power, high-density cooling. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. It is specifically optimized for high-power laser modules, industrial laser processing equipment, high-power electronic components, and medical and cosmetic devices—all of which require large-area temperature control and can handle extremely high thermal loads. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-06302 is a semiconductor cooling module designed for large-area, medium-power precision temperature control. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-06301 is a semiconductor cooling module designed for large-area, low-power, high-voltage precision temperature control. With dimensions of 20 × 40 mm and a rectangular symmetrical package design, it offers a large heat exchange area while maintaining excellent spatial adaptability. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw