🔷Cooler with Peltier Product Drawing

🔷Peltier Device Cooler Basic Performance Spec

🔷Peltier Module Cooler Additional Performance Spec

🔷Peltiers Performance Curve

🔷Thermoelectric Peltier Device Product Overview

The TEC1-09912 is a top-of-the-line flagship semiconductor cooling module designed for cooling extremely large areas at extreme power densities. Measuring 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. Optimized for applications requiring massive surface-area temperature control and extremely high thermal loads—such as extreme-power industrial laser modules, large-scale high-power industrial equipment, and high-performance medical devices—it is the most powerful flagship model in the series.

This product is available in three crystal configurations—K10, K12, and K14—with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 12.0 V, a maximum current of 12.0 A, a maximum cooling power of 144 W, and an internal resistance of just 0.78 Ω.

The extra-large 30×60mm rectangular package allows it to be embedded inside high-power laser modules, large industrial equipment, and other applications—while ensuring a maximum cooling temperature difference of 70°C and cooling for 144W of peak power, the 30mm width and 60mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling to the surface of very large loads. This product is designed to operate at 12.0 V and 12.0 A, making it highly compatible with common industrial power supplies (12 V) and telecommunications equipment power platforms. With an ultra-low maximum internal resistance of 0.78Ω—the lowest in this series—Joule heat loss (I²R ≈ 112.3W) at a high current of 12.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintered process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper; the relatively thick copper layer ensures uniform heat dissipation across the extra-large 60 mm × 30 mm surface area. It comes standard with 16 AWG silicone rubber leads (200 mm in length), capable of safely carrying the high current of 12.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration.

This product is typically used in applications such as temperature control for high-power industrial laser modules, heat dissipation for large-scale industrial equipment, high-performance medical devices, and high-power communication base stations. It is the premier flagship choice for cooling applications requiring extreme power density over very large surface areas.

🔷Peltier Device Product Applications

1. Temperature Control for Extreme Ultra-High-Power Industrial Laser Modules

Extreme ultra-high-power industrial semiconductor laser modules generate a significant amount of heat during operation. The TEC1-09910’s 120W extreme ultra-high-power cooling capacity enables efficient temperature control across an extra-large 30×60mm area, stabilizing the laser temperature within ±0.05°C of the setpoint. It is suitable for extreme ultra-high-power laser processing, optical communications, and LIDAR systems.

2. Heat Dissipation for Large Industrial Equipment

High-power electronic components and power modules in large industrial equipment generate concentrated heat during operation. The TEC1-09910 can be mounted directly on the component surface; its 120W extreme ultra-high-power cooling capability provides robust active cooling, reducing core temperatures by more than 25°C and enhancing equipment reliability and service life.

3. Temperature Control for High-Performance Medical Equipment

High-end medical imaging equipment and large-scale in vitro diagnostic devices require a strictly controlled, constant-temperature environment. With its large coverage area, maintenance-free operation, and stable performance, the TEC1-09910 delivers powerful cooling capabilities.

4. Heat Dissipation for High-Power Communication Base Stations

High-power communication devices, such as 5G communication base stations and high-power transmitters, generate concentrated heat. The TEC1-09910 can be used for active cooling, and its 12.0V operating voltage is fully compatible with communication equipment power platforms.

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