🔷Peltier Heater Cooler Product Drawing

🔷Advanced TEC Basic Performance Spec

🔷Thermoelectric Cooling Devices Additional Performance Spec

🔷Peltier Elements Performance Curve

🔷Thermoelectric Controller Product Overview

The TEC1-19504 is a flagship semiconductor cooling module designed for cooling applications requiring extremely large surface areas, ultra-high power, and high voltage density. measuring 30 × 60 mm. Featuring a large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring extensive temperature control and handling extremely high thermal loads—such as ultra-high-power industrial laser modules, large-scale high-power industrial equipment, and high-performance medical devices.

This product is available in three crystal configurations—K10, K14, and K18—with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 4.0 A, a maximum cooling power of 96 W, and an internal resistance of 4.68 Ω.

The extra-large 30×60 mm rectangular package allows it to be embedded within ultra-high-power laser modules, large industrial equipment, and other applications. While ensuring a maximum cooling temperature difference of 70°C and ultra-high cooling power of 96W, the 30 mm width and 60 mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the large surface area of the load. This product features a 24V high-voltage, 4.0A current drive design, making it highly compatible with common industrial power supplies (24V) and telecommunications equipment power platforms. The low internal resistance of 4.68Ω effectively controls Joule heat loss (I²R ≈ 74.9W) at 4.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintered process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper; the relatively thick copper layer ensures uniform heat dissipation across the 60 mm × 30 mm ultra-large surface area. It comes standard with 22 AWG silicone rubber leads (200 mm in length), capable of safely carrying a 4.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration.

This product is typically used in applications such as temperature control for ultra-high-power industrial laser modules, heat dissipation for large-scale industrial equipment, high-performance medical devices, and high-power communication base stations. It is the flagship choice for ultra-high-power-density cooling requirements in very large-area spaces.

🔷Thermal Generators Product Features

1. Extra-large, symmetrical design with ample heat exchange area

The extra-large 30×60 mm rectangular package provides an extremely generous heat exchange area, making it ideal for large, ultra-high-power temperature-controlled equipment.

2. Ultra-high-power cooling with top-tier performance

With a maximum current of 4.0 A and a maximum power of 96 W, it achieves top-tier power density cooling within its extra-large package.

3. Deep Cooling Capability, Large Surface Area with High Temperature Differential

Achieves a maximum temperature differential of 70°C at an ultra-high power of 96W, with the cold end reaching as low as approximately -30°C.

4. Three Chip Options for Flexible Adaptability

Offers three chip configurations: K10 (60°C), K14 (65°C), and K18 (70°C).

5. Low Internal Resistance Design for Efficient Power Conversion

With an internal resistance of only 4.68 Ω, Joule heat loss is effectively controlled at a current of 4.0 A, allowing more electrical energy to be converted into effective cooling capacity.

6. Ultra-Thin Design to Save Vertical Space

With a thickness of only 3.4–4.2 mm, it maintains an excellent slim profile among ultra-high-power models.

7. Excellent Power Supply Compatibility

With a maximum voltage of 24.0 V, it is highly compatible with common industrial power supplies (24 V), telecommunications equipment power supplies, and other platforms.

8. High-Quality Substrate with Superior Heat Dissipation Across a Large Area

A thick copper layer ensures uniform heat distribution and efficient heat dissipation across the 60 mm × 30 mm large surface area.

9. High Adaptability to Assembly Pressure

The recommended assembly pressure is 4.5 kg (0.25 kg/cm²), ensuring tight contact with the large-area heat sink.

10. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.

11. Bidirectional Temperature Control, Dual-Function Single Core

Reversing the current polarity activates heating mode, enabling bidirectional temperature regulation.

12. Zero Noise, Zero Vibration, Precision Operation

The all-solid-state design ensures completely silent and vibration-free operation.

🔷Thermoelectric Devices Product Structure