🔷Thermoelectric Cooling Device Product Drawing

🔷Thermoelectric Cooling Element Basic Performance Spec

🔷Thermoelectric Generation Additional Performance Spec

🔷Thermoelectric Generator Modules Performance Curve

🔷Thermo Cooler Product Overview

The TEC1-19502 is a semiconductor cooling module designed for high-precision temperature control of large-area, medium-power, high-voltage applications. With dimensions of 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. It is optimized for industrial-grade laser modules, large medical and cosmetic devices, industrial analytical instruments, communication base stations, and other equipment requiring temperature control over a very large area with moderate power.

This product is available in three crystal configurations—K12, K22, and K32—with thicknesses of 3.6 mm, 4.6 mm, and 5.6 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 2.2 A, a maximum cooling power of 53 W, and an internal resistance of 8.51 Ω.

The extra-large 30×60 mm rectangular package allows it to be embedded within large laser modules, medical devices, industrial equipment, and other applications. While ensuring a maximum cooling temperature difference of 70°C and a cooling power of 53 W, the 30 mm width and 60 mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the large surface area of the load. This product features a drive design with a high voltage of 24V and a moderate current of 2.2A, making it highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and automotive power platforms, eliminating the need for complex power conversion. The high internal resistance of 8.51Ω ensures precise current control at low currents, enabling the drive circuit to achieve high-precision constant-current regulation and thereby deliver stable temperature control. The substrate is manufactured using a sintering process that combines 96% alumina ceramic (0.76 mm) with 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the 60 mm × 30 mm ultra-large surface area, preventing localized hot spots. It comes standard with 22 AWG silicone-coated leads (200 mm in length), which can safely carry a current of 2.2 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration.

This product is typically used in applications such as temperature control for large industrial laser modules, large medical and cosmetic equipment, temperature stabilization for industrial analytical instruments, heat dissipation for telecommunications base station equipment, industrial laser processing equipment, and large medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving high voltage and medium power over an extremely large area.

🔷Peltier Heater Product Selection

🔷TEC Peltier Work Principle

The TEC1-16502 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 165 pairs of semiconductor grains (the “165” in the model number refers to 165 pairs), representing an ultra-large-scale thermopile design—with an extremely high number of thermocouple pairs capable of generating significant temperature differences and cooling capacity at very low currents, providing efficient heat pump performance for temperature control over an extra-large 60mm × 30mm area. The 0.4 mm-thick oxygen-free copper layer ensures uniform heat diffusion across the 60 mm × 30 mm ultra-large area.

When a forward DC voltage (maximum 22.0 V) is applied, a 1.6 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As the carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot-end node releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.

The core advantage of this product lies in its drive design featuring a relatively high voltage of 22.0V and a low current of 1.6A. The 22.0V voltage is very close to that of common industrial power supply platforms (24V), allowing for application with only a simple step-down conversion—no complex power conversion circuits are required. At the same time, the combination of high voltage and low current minimizes line losses (I²R), making it particularly suitable for applications requiring long-distance wiring. The high internal resistance of 13.75Ω facilitates precise control of the 1.6A current at 22.0V, placing lower demands on the precision of the drive circuit and enabling high-precision constant-current control. The 0.4mm-thick copper layer helps evenly dissipate heat from the hot end across the 60mm × 30mm extra-large surface area, preventing localized overheating and improving heat dissipation efficiency.

This product achieves a maximum temperature difference of 70°C at a hot-end temperature of 40°C (K36 model), meaning the cold end can reach as low as approximately -30°C. Achieving this level of deep cooling at a low input power of 35W demonstrates excellent energy efficiency. The 30 × 60 mm ultra-large surface area design allows it to fit snugly against oversized loads such as large laser modules and industrial equipment. The large contact area and short heat transfer path effectively reduce the contact thermal resistance between the cold end and the load.