🔷Cooling Module Product Drawing

🔷Tec Thermoelectric Cooler Basic Performance Spec

🔷Semiconductor Cooler Additional Performance Spec

🔷TEC Peltier Module Performance Curve

🔷Peltier Heater Cooler Product Overview

The TEC1-20204 is a semiconductor cooling plate designed for ultra-large-area, high-power, industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is one of the largest models in the series. Featuring an ultra-large, rectangular, symmetrical package design, it provides an exceptionally large heat exchange area and is optimized for equipment requiring extensive temperature control and high thermal loads, such as large-scale industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring extensive temperature control over a large area and handling high thermal loads.

This product is available in three crystal configurations—K24, K32, and K40—with thicknesses of 4.8 mm, 5.6 mm, and 6.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 4.0 A, a maximum cooling power of 96 W, and an internal resistance of 4.68 Ω.

The extra-large 50×100mm rectangular package allows it to be embedded within high-power industrial equipment and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and high-power cooling of 96W, the 50mm width and 100mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the surface of very large loads. This product features a 24V high-voltage, 4.0A current drive design, making it highly compatible with common industrial power supplies (24V) and telecommunications equipment power platforms, eliminating the need for complex power conversion. The low internal resistance of 4.68Ω effectively controls Joule heat loss (I²R ≈ 74.9W) at a current of 4.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 100 mm × 50 mm surface area, preventing localized hot spots. It comes standard with 20 AWG silicone rubber leads (300 mm in length) capable of safely carrying a 4.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 12.5 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.

This product is typically used in applications such as temperature control for high-power, large-scale industrial laser modules; medical imaging equipment; temperature stabilization for industrial analytical instruments; heat dissipation for telecommunications base station equipment; industrial laser processing equipment; and large-scale medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving extra-large areas, high voltage, and high power.

🔷Advanced TEC Product Features

1. Extra-large, symmetrical design with ample heat exchange area

The 50×100 mm extra-large rectangular package is one of the largest models in this series, providing an extremely ample heat exchange area. This facilitates uniform heat transfer to the surface of extra-large loads, making it suitable for large, high-power temperature-controlled equipment.

2. High-Power Cooling with Robust Performance

With a maximum current of 4.0 A and a maximum power of 96 W, this unit achieves high-power-density cooling within its extra-large, high-surface-area package, making it suitable for large equipment with high thermal loads.

3. Deep Cooling Capability, Extra-Large Surface Area, and Wide Temperature Difference

It achieves a maximum temperature difference of 70°C at a high power of 96W, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep cooling.

4. Three Crystal Options for Flexible Adaptation

Three crystal configurations are available: K24 (60°C), K32 (65°C), and K40 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.

5. Three Thickness Options for Different Spaces

Thicknesses are 4.8 mm, 5.6 mm, and 6.4 mm. The K40 model, at 6.4 mm thick, provides ample space for the cooling elements in ultra-large-area cooling applications, helping to achieve 70°C deep cooling.

6. High-Voltage Design for Excellent System Compatibility

With a maximum voltage of 24.0V, it is highly compatible with common industrial power supplies (24V) and telecommunications equipment power platforms, eliminating the need for complex power conversion.

7. Low Internal Resistance Design for Efficient Power Conversion

With an internal resistance of only 4.68Ω, Joule heating loss is effectively controlled at a current of 4.0A, ensuring that more electrical energy is converted into effective cooling capacity rather than self-generated heat.

8. High-Quality Substrate, Uniform Heat Dissipation Across an Extra-Large Surface Area

The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.4 mm). The thick copper layer ensures that heat is evenly distributed and rapidly dissipated across an extra-large surface area of 100 mm × 50 mm.

9. Extra-Long Leads for Flexible Wiring in Large Equipment

Comes standard with 20 AWG silicone-coated wire (300 mm in length) to meet the wiring requirements of large equipment and facilitate flexible routing inside the equipment.

10. Exceptional Adaptability to High Assembly Pressure

Recommended assembly pressure of 12.5 kg (0.25 kg/cm²), ensuring tight contact between the extra-large cooling plate, the heat sink, and the surface being cooled, effectively reducing contact thermal resistance and adapting to industrial environments.

11. Sealed Protection, Strong Environmental Adaptability

Perimeter sealing with 704 silicone rubber provides excellent moisture, dust, and shock resistance, enabling operation in complex industrial environments with high humidity and significant temperature fluctuations.

12. Bidirectional Temperature Control, Dual-Function Single Core

Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.

13. Zero Noise, Zero Vibration, Precision Operation

The all-solid-state design ensures completely silent and vibration-free operation, making it ideal for high-precision industrial applications with strict noise and vibration requirements.

🔷Thermoelectric Cooling Devices Work Principle

TEC1-20204 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 202 pairs of crystals (the “202” in the model number denotes 202 pairs of crystals), representing an ultra-large-scale thermopile design—with a high number of thermocouple pairs, it can generate a significant temperature difference and cooling capacity at moderate currents, providing ample heat pump capacity for temperature control of an extra-large 100 mm × 50 mm area. The 0.4 mm thick oxygen-free copper layer ensures uniform heat diffusion across the 100 mm × 50 mm ultra-large area.

When a forward DC voltage (up to 24.0 V) is applied, a 4.0 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As a large number of charge carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot-end node releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.

This product is designed to operate at 24.0V and 4.0A, making it highly compatible with common 24V industrial power supply platforms. It requires no additional step-up or step-down circuits, simplifying system power supply design. The low internal resistance of 4.68Ω effectively controls Joule heating (I²R ≈ 74.9W), allowing more electrical energy to be converted into effective cooling capacity. The 0.4mm-thick copper layer helps heat from the hot end diffuse uniformly across the 100mm × 50mm extra-large surface area, preventing localized overheating and improving heat dissipation efficiency.

At a hot-end temperature of 40°C, this product achieves a maximum temperature difference of 70°C (K40 model), meaning the cold end can reach as low as approximately -30°C. Achieving this level of deep cooling at an input power of 96W demonstrates balanced energy efficiency. The extra-large 50×100mm layout allows it to fit snugly against oversized loads such as large laser modules and industrial equipment; the large contact area and short heat transfer path effectively reduce the contact thermal resistance between the cold end and the load.