The TEC1-20205 is a semiconductor cooling plate designed for ultra-large-area, ultra-high-power industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is currently one of the largest models in this series. Featuring an ultra-large rectangular symmetrical packaging design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring ultra-large-area temperature control and extremely high thermal loads, such as large-scale industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling extremely high thermal loads. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🔷Peltier Elements Product Drawing

🔷Thermoelectric Controller Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-20205 | K18 | 60 | 3.74 | 24.0 | 5.0 | 120 | 50×100×4.2 |
| TEC1-20205 | K28 | 65 | 3.74 | 24.0 | 5.0 | 120 | 50×100×5.2 |
| TEC1-20205 | K38 | 70 | 3.74 | 24.0 | 5.0 | 120 | 50×100×6.2 |
🔷Thermal Generators Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 20 AWG, L = 300 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 12.5 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermoelectric Devices Performance Curve

🔷Peltier Element Cooler Product Overview
The TEC1-20205 is a semiconductor cooling plate designed for ultra-large-area, ultra-high-power industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is currently one of the largest models in this series. Featuring an ultra-large rectangular symmetrical packaging design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring ultra-large-area temperature control and extremely high thermal loads, such as large-scale industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling extremely high thermal loads.
This product is available in three crystal configurations—K18, K28, and K38—with thicknesses of 4.2 mm, 5.2 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 5.0 A, a maximum cooling power of 120 W, and an internal resistance of 3.74 Ω.
The extra-large 50×100 mm rectangular package allows it to be embedded within ultra-high-power large-scale industrial equipment, ultra-high-power laser modules, and similar systems—while ensuring a maximum cooling temperature difference of 70°C and ultra-high cooling power of 120 W, the 50 mm width and 100 mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the surface of extra-large loads. This product features a 24V high-voltage, 5.0A current drive design, making it highly compatible with common industrial power supplies (24V) and telecommunications equipment power platforms. The low internal resistance of 3.74Ω effectively controls Joule heat loss (I²R ≈ 93.5W) at 5.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the 100 mm × 50 mm ultra-large surface area, preventing localized hot spots. It comes standard with 20 AWG silicone rubber leads (300 mm in length), capable of safely carrying the high current of 5.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 12.5 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for ultra-high-power large industrial laser modules, medical imaging equipment, temperature stabilization for industrial analytical instruments, heat dissipation for telecommunications base station equipment, industrial laser processing equipment, and large-scale medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving ultra-high power and large-area spaces.
🔷Thermoelectric Generator Product Selection
| 模型 | 热电偶对 | Umax(伏特) | Imax(安培) | DTmax(°C) | 瓦特 | 电阻器(Ω) | 长度(mm) | 宽度(mm) |
| TEC-03102-30x6x3.25 | 31 | 3.8 | 2.2 | 67 | 4.6 | 1.37 | 30 | 6 |
| TEC-03102-30x6x3.3 | 31 | 3.8 | 2.7 | 66 | 5.7 | 1.11 | 30 | 6 |
| TEC-03104-30x6x3.3 | 31 | 3.8 | 4.3 | 66 | 8.9 | 0.71 | 30 | 6 |
| TEC-06102-30x5.7x3.1 | 61 | 7.4 | 2 | 67 | 8.1 | 3 | 30 | 5.7 |
| TEC-06503-30x7x2.55 | 65 | 7.9 | 3.4 | 67 | 15 | 1.85 | 30 | 7 |
| TEC-06302-38x7.6x3.04 | 63 | 7.6 | 2.4 | 67 | 10 | 2.59 | 38 | 7.6 |
| TEC-03102-30x8x3.8 | 31 | 3.8 | 2.9 | 67 | 6.1 | 1.03 | 30 | 8 |
| TEC-07102-30x8x2.9 | 71 | 8.6 | 2.7 | 67 | 12.7 | 2.6 | 30 | 8 |
| TEC-06502-8x40x3 | 65 | 7.9 | 2.4 | 67 | 10.7 | 2.59 | 8 | 40 |
| TEC-05304-30x9.8x3.1 | 53 | 6.4 | 4.2 | 67 | 15.1 | 1.22 | 30 | 9.8 |
| TEC-01704-10x10x3.1 | 17 | 2.1 | 4.1 | 68 | 4.7 | 0.4 | 10 | 10 |
| TEC-03101-10x10x3 | 31 | 3.8 | 1.4 | 68 | 2.9 | 2.2 | 10 | 10 |
| TEC-06303-60x10x3.7 | 63 | 7.6 | 3.4 | 67 | 14.4 | 1.81 | 60 | 10 |
| TEC-04901-12x12x2.9 | 49 | 5.9 | 1.5 | 67 | 5 | 3.15 | 12 | 12 |
| TEC-03102-15x15x4 | 31 | 3.8 | 2.5 | 66 | 5.3 | 1.19 | 15 | 15 |
| TEC-03102-15x15x3.8 | 31 | 3.8 | 2.8 | 66 | 5.9 | 1.07 | 15 | 15 |
| TEC-04904-15x15x3.1 | 49 | 5.9 | 4.2 | 67 | 13.9 | 1.13 | 15 | 15 |
| TEC-04804-15x15x3.32 | 48 | 5.8 | 4.3 | 66 | 13.7 | 1.1 | 15 | 15 |
| TEC-04902-18x18x4 | 49 | 5.9 | 2.4 | 67 | 7.8 | 2.02 | 18 | 18 |
| TEC-04902-20x20x4 | 49 | 5.9 | 2.1 | 66 | 6.8 | 2.32 | 20 | 20 |
| TEC-04903-20x20x3.6 | 49 | 5.9 | 3.1 | 66 | 10.1 | 1.55 | 20 | 20 |
| TEC-07102-20x20x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 20 | 20 |
| TEC-07103-20x20x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 20 | 20 |
| TEC-06311-20x40x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 20 | 40 |
| TEC-06311-40x20x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 40 | 20 |
| TEC-07102-23x23x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 23 | 23 |
| TEC-07103-23x23x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 23 | 23 |
| TEC-04903-25x25x4.2 | 49 | 5.9 | 3.9 | 67 | 12.9 | 1.22 | 25 | 25 |
| TEC-07102-30x30x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 30 | 30 |
| TEC-07103-30x30x3.7 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 30 | 30 |
| TEC-07103-30x30x4 | 71 | 8.6 | 3.6 | 66 | 17.4 | 1.9 | 30 | 30 |
| TEC-12701-30x30x4.55 | 127 | 15.4 | 1.3 | 67 | 11.4 | 9.25 | 30 | 30 |
| TEC-12702-30x30x4.2 | 127 | 15.4 | 2 | 67 | 17.4 | 6.08 | 30 | 30 |
| TEC-12702-30x30x4.07 | 127 | 15.4 | 2.2 | 67 | 18.9 | 5.6 | 30 | 30 |
| TEC-12703-30x30x3.7 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 30 | 30 |
| TEC-12704-30x30x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 30 | 30 |
| TEC-12702-40x40x4.2 | 127 | 15.4 | 2.8 | 66 | 24.1 | 4.38 | 40 | 40 |
| TEC-12703-40x40x3.9 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 40 | 40 |
| TEC-12704-40x40x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 40 | 40 |
| TEC-12704-40x40x4 | 127 | 15.4 | 4.8 | 66 | 41.1 | 2.57 | 40 | 40 |
| TEC-12705-40x40x3.65 | 127 | 15.4 | 5.6 | 66 | 48 | 2.2 | 40 | 40 |
| TEC-12706-40x40x3.95 | 127 | 15.4 | 6.6 | 67 | 55.9 | 1.89 | 40 | 40 |
| TEC-12707-40x40x4 | 127 | 15.4 | 7.4 | 67 | 62.9 | 1.68 | 40 | 40 |
| TEC-12708-40x40x3.6 | 127 | 15.4 | 8.8 | 67 | 74.9 | 1.41 | 40 | 40 |
| TEC-12716-40x40x3.2 | 127 | 15.4 | 16.3 | 66 | 139 | 0.76 | 40 | 40 |
| TEC-06303-40x20x3.6 | 63 | 7.6 | 3 | 3.4 | 22.8 | 1.98 | 40 | 20 |
🔷Thermoelectric Cooler Installation and Usage Recommendations
Assembly Pressure: 12.5 kg (0.25 kg/cm²) is recommended. Extra-large cooling plates require extremely high assembly pressure to ensure a tight fit with the heat sink and the surface being cooled, thereby effectively reducing thermal contact resistance. It is recommended to apply a uniform layer of high-performance thermal grease (thermal conductivity > 5 W/m·K) to both surfaces, with a thickness of 0.05–0.1 mm.
Installation Orientation: The 50×100 mm extra-large TEC has a specific dimensional orientation. During installation, ensure that the 100 mm long side aligns with the length of the device being cooled to achieve optimal thermal contact coverage.
Hot-End Cooling Requirements (Important): With a relatively high power dissipation of 120 W, it is recommended to use a large extruded aluminum heat sink measuring at least 55 × 105 × 45 mm, paired with a high-airflow fan (airflow > 30 CFM) or a heat pipe/liquid cooling solution to ensure timely heat dissipation from the hot end. The cooling efficiency of the hot end directly determines the lowest achievable temperature at the cold end.
Power Supply Requirements: Maximum voltage 24.0V, maximum current 5.0A. We recommend using a regulated power supply rated at 24V/6A or higher (either industrial or telecommunications power supplies are acceptable). The power supply ripple should be < 50mV.
Lead Wires: Standard configuration includes 20 AWG silicone-coated wires (300 mm in length), which fully meet the 5.0 A requirement; the extra-long leads facilitate wiring inside large equipment.
Current Limit: Must not exceed 5.0A. It is recommended to connect a 6A self-resetting fuse in series for overcurrent protection.
Anti-Condensation Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation; coat the lead solder joints with conformal coating.
Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.
Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.
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The TEC1-20210 is a flagship industrial semiconductor cooling module designed for extremely large surface areas and extreme, top-tier power density cooling. Measuring 50 × 100 mm, it is currently one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring extreme power density, ultra-high-power laser modules, high-performance medical devices, and other applications demanding extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-20208 is a flagship industrial semiconductor cooling module designed for extremely large surface areas and extreme, top-tier power density cooling. Measuring 50 × 100 mm, it is currently one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring extreme power density, ultra-high-power laser modules, high-performance medical devices, and other applications demanding extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
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The TEC1-20204 is a semiconductor cooling plate designed for ultra-large-area, high-power, industrial-grade precision temperature control. With dimensions of 50 × 100 mm, it is one of the largest models in the series. Featuring an ultra-large, rectangular, symmetrical package design, it provides an exceptionally large heat exchange area and is optimized for equipment requiring extensive temperature control and high thermal loads, such as large-scale industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring extensive temperature control over a large area and handling high thermal loads. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
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