🔷Peltier Device Product Drawing

🔷Thermoelectric Module Basic Performance Spec

🔷Thermoelectric Peltier Additional Performance Spec

🔷TEG Module Performance Curve

🔷Solid State Cooler Product Overview

The TEC1-25501 is an industrial-grade semiconductor cooling module designed for ultra-large-area, ultra-high-voltage, ultra-low-power precision temperature control. Measuring 40 × 80 mm, it features an extra-large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. It is optimized for large industrial equipment, ultra-high-power laser modules, medical imaging equipment, communication base stations, and other devices that require temperature control over a very large area while operating within extremely tight power budgets.

This product is available in three die configurations—K28, K34, K40 chip configurations, with thicknesses of 5.2 mm, 5.8 mm, and 6.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-side temperature of Th=40°C). The maximum voltage is 30.6 V, the maximum current is only 1.4 A, the maximum cooling power is 43 W, and the internal resistance is 17.05 Ω.

The extra-large 40×80mm rectangular package allows it to be embedded within large industrial equipment, ultra-high-power laser modules, and similar systems—while ensuring a maximum cooling temperature difference of 70°C and a cooling power of 43W, the 40mm width and 80mm length provide an extremely generous heat exchange area, facilitating the uniform transfer of cooling capacity to the surface of extremely large loads. The core advantage of this product lies in its drive design featuring an ultra-high voltage of 30.6V and an ultra-low current of 1.4A—making it highly compatible with common platforms such as industrial power supplies (30V), telecommunications equipment power supplies, and automotive power supplies, without the need for complex power conversion. The combination of ultra-high voltage and ultra-low current minimizes line losses (I²R), making it suitable for long-distance lead wiring and distributed temperature control systems. The ultra-high internal resistance of 17.05Ω ensures precise current control at the ultra-low current of 1.4A, enabling the drive circuit to achieve high-precision constant-current regulation and thereby deliver stable temperature control. The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76mm) and 0.4mm oxygen-free copper; the thick copper layer ensures uniform heat diffusion across the ultra-large 80mm × 40mm surface area. It comes standard with 22 AWG silicone-coated leads (200 mm in length), capable of safely carrying a 1.4 A current. Sealed with 704 silicone rubber around the perimeter, it is fully solid-state, noise-free, and vibration-free, ensuring stable and reliable operation. Recommended assembly pressure is up to 8.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and shocks in industrial environments.

This product is typically used in applications such as temperature control for large industrial laser modules, medical imaging equipment, temperature stabilization for industrial analytical instruments, and heat dissipation for telecommunications base station equipment. It is the ideal choice for precision temperature control requirements involving extremely large areas, extremely high voltages, and ultra-low power consumption.

🔷Thermoelectric Power Generator Product Feature

1. Extra-large, symmetrical design with ample heat exchange area

The extra-large 40×80 mm rectangular package provides an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of extra-large loads, making it suitable for large-scale industrial temperature control equipment.

2. Ultra-high voltage, ultra-low current design for excellent system compatibility

With a maximum voltage of 30.6V, it is highly compatible with common industrial power supplies (30V) and telecommunications equipment power platforms. The ultra-low current of 1.4A minimizes line losses, making it suitable for long-distance lead wiring.

3. Ultra-low-power operation, energy-efficient and high-performance

With a maximum current of only 1.4A and a maximum power of just 43W, it achieves an excellent balance between ultra-low power consumption and deep cooling within an extra-large-area package, making it suitable for industrial equipment with strict energy efficiency requirements.

4. Deep Cooling Capability, Large Temperature Differential for Extra-Large Areas

It achieves a maximum temperature differential of 70°C at an ultra-low power consumption of just 43W, with the cold end reaching as low as approximately -30°C.

5. Three Chip Options for Flexible Adaptation

Three chip configurations are available: K28 (60°C), K34 (65°C), and K40 (70°C).

6. Three Thickness Options for Different Space Requirements

Thicknesses are 5.2 mm, 5.8 mm, and 6.4 mm. The K40 model, with a thickness of 6.4 mm, provides ample space for the die, enabling cooling of extra-large areas.

7. Ultra-High Internal Resistance Design for Precise Current Control

An internal resistance of 17.05 Ω facilitates precise control of a 1.4 A current at 30.6 V, placing low demands on the drive circuit and making it suitable for high-precision constant-current source drives.

8. High-quality substrate ensures uniform heat diffusion across an extra-large area

A thick copper layer ensures that heat is evenly distributed and rapidly dissipated across the extra-large 80 mm × 40 mm area.

9. Exceptional Adaptability to High Assembly Pressure

The recommended assembly pressure of 8.0 kg (0.25 kg/cm²) ensures that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance.

10. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.

🔷Element Peltier Operation Principle

The TEC1-25501 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive ceramic substrates. With 255 pairs of crystals, this is an ultra-large-scale thermoelectric stack design featuring an extremely high number of thermocouple pairs, capable of generating a significant temperature difference and cooling capacity even at very low currents.

When a forward DC voltage (up to 30.6 V) is applied, a 1.4 A current drives carriers to exchange energy at the PN junction interface—the cold end absorbs phonon energy and cools, while the hot end releases energy and heats up. Heat is continuously “pumped” from the cold end to the hot end.

The drive design, featuring an ultra-high voltage of 30.6 V and an ultra-low current of 1.4 A, is highly compatible with 30 V industrial power supply platforms. The ultra-high internal resistance of 17.05 Ω makes precise current control easier. This product achieves a maximum temperature difference of 70 °C (K40 model) when the hot end temperature is 40 °C, with the cold end reaching as low as approximately -30 °C.