🔷Peltier Module Cooler Product Drawing

🔷Peltiers Basic Performance Spec

🔷Thermoelectric Peltier Device Additional Performance Spec

🔷Peltier Device Performance Curve

🔷Thermoelectric Module Product Overview

The TEC1-25508 is a top-of-the-line industrial semiconductor cooling module designed for extremely large areas and extreme high-power-density cooling. Measuring 40 × 80 mm, it features an extra-large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. Optimized for applications requiring extensive area temperature control and extremely high thermal loads—such as ultra-high-power industrial laser modules, large-scale high-power industrial equipment, and high-performance medical devices—it is the most powerful flagship model in the series.

This product is available in three chip configurations—K10, K12, and K14—with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of 30.6 V, a maximum current of 8.0 A, a maximum cooling power of 245 W, and an internal resistance of just 2.98 Ω.

The extra-large 40×80 mm rectangular package allows it to be embedded inside extreme ultra-high-power laser modules, large industrial equipment, and similar applications—while ensuring a maximum cooling temperature difference of 70°C and extreme ultra-high-power cooling of 245 W, the 40 mm width and 80 mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the surface of extra-large loads. This product features a drive design rated for 30.6 V high voltage and 8.0 A current, making it highly compatible with common industrial power supplies (30 V) and telecommunications equipment power platforms. The ultra-low internal resistance of 2.98 Ω effectively controls Joule heating losses (I²R ≈ 190.7 W) at 8.0 A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 80 mm × 40 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone rubber leads (200 mm in length), capable of safely carrying the high current of 8.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state structure ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 8.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.

This product is typically used in applications such as temperature control for extreme ultra-high-power industrial laser modules, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the premier flagship choice for extreme ultra-high-power-density cooling requirements across very large surface areas.

🔷Thermoelectric Peltier Product Features

1. Extra-large, symmetrical design with ample heat exchange area

The extra-large 40×80 mm rectangular package provides an exceptionally ample heat exchange area, making it suitable for large, extreme-high-power temperature-controlled equipment.

2. Extreme-high-power cooling with top-tier performance

With a maximum current of 8.0 A and a maximum power of 245 W, it achieves top-tier power density cooling within its extra-large package, making it the most powerful flagship model in the series.

3. Deep cooling capability with a large temperature difference across the extra-large surface area

It achieves a maximum temperature difference of 70°C at the extreme ultra-high power of 245 W, with the cold end reaching as low as approximately -30°C.

4. Three Chip Options for Flexible Adaptability

Offers three chip configurations: K10 (60°C), K12 (65°C), and K14 (70°C).

5. Ultra-Low Internal Resistance Design for Efficient Power Conversion

With an internal resistance of just 2.98 Ω, it is one of the models with the lowest internal resistance in this series. At a high current of 8.0 A, Joule heating losses are effectively controlled, allowing more electrical energy to be converted into effective cooling capacity.

6. Ultra-Thin Design, Saving Vertical Space

With a thickness of only 3.4–3.8 mm, it maintains an excellent slim-profile design among extreme high-power models.

7. Excellent Power Supply Compatibility

With a maximum voltage of 30.6 V, it is highly compatible with common industrial power supplies (30 V), telecommunications equipment power supplies, and other platforms.

8. High-Quality Substrate, Excellent Heat Dissipation Across an Extra-Large Area

A thick copper layer ensures uniform heat distribution and efficient heat dissipation across an extra-large area of 80 mm × 40 mm.

9. Extra-Thick, Long Leads for Safe 8.0A Current Carrying Capacity

Standard 18 AWG silicone-coated wires (200 mm long) meet the demands of high-current transmission and wiring for large equipment.

10. Exceptional Adaptability to High Mounting Pressures

Recommended mounting pressure of 8.0 kg (0.25 kg/cm²) ensures tight contact with extra-large heat sinks.

11. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.

12. Bidirectional Temperature Control, Dual-Function Single Core

Reversing the current polarity activates heating mode, enabling bidirectional temperature regulation.

13. Zero Noise, Zero Vibration, Precision Operation

Fully solid-state construction ensures completely silent and vibration-free operation.

🔷TEG Module Installation and Usage Recommendations

Assembly Pressure: Recommended 8.0 kg (0.25 kg/cm²). It is recommended to apply high-performance thermal grease (thermal conductivity > 5 W/m·K) evenly to both surfaces.

Hot-End Cooling Requirements (Critical): With a power consumption of 245 W, heat generation is extremely high. We recommend using a large extruded aluminum heatsink measuring at least 50 × 90 × 60 mm, paired with a high-airflow fan (airflow > 50 CFM), or implementing a water-cooling solution to ensure timely heat dissipation from the hot end. The cooling efficiency of the hot end directly determines the lowest achievable temperature at the cold end.

Power Supply Requirements: Maximum voltage 30.6 V, maximum current 8.0 A. A regulated power supply rated at 30 V/10 A or higher is recommended. Power supply ripple < 50 mV.

Lead Wires: Standard 18 AWG silicone-coated wire (200 mm length) is included, rated for 8.0 A.

Current Limit: Must not exceed 8.0A; it is recommended to connect a 10A self-resetting fuse in series.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh.

Maximum Temperature: Must not exceed 138°C; soldering temperature < 280°C, duration < 5 seconds.