🔷Semiconductor Cooler Product Drawing

🔷TEC Peltier Module Basic Performance Spec

🔷Peltier Cooler Additional Performance Spec

🔷Peltier Heater Cooler Performance Curve

🔷Advanced TEC Product Overview

The TEC1-25504 is a flagship industrial semiconductor cooling module designed for cooling applications requiring extremely large surface areas, ultra-high power, and high voltage density. With dimensions of 40 × 80 mm, it features an extra-large, rectangular, symmetrical package design that provides an exceptionally large heat exchange area. It is specifically optimized for large industrial equipment with ultra-high power, ultra-high-power laser modules, high-performance medical imaging equipment, large telecommunications base stations, and other equipment requiring temperature control over an extremely large area and handling extremely high thermal loads.

This product is available in three die configurations—K10, K18, and K26—with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 30.6 V, a maximum current of 4.0 A, a maximum cooling power of 122 W, and an internal resistance of 5.97 Ω.

The extra-large 40×80 mm rectangular package allows it to be embedded inside ultra-high-power laser modules, large industrial equipment, and other applications—while ensuring a maximum cooling temperature difference of 70°C and ultra-high cooling power of 122 W, the 40 mm width and 80 mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the surface of very large loads. This product features a drive design rated for 30.6V high voltage and 4.0A current, making it highly compatible with common industrial power supplies (30V) and telecommunications equipment power platforms. The low internal resistance of 5.97Ω effectively controls Joule heating loss (I²R ≈ 95.5W) at 4.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper; the relatively thick copper layer ensures uniform heat dissipation across the 80 mm × 40 mm extra-large surface area. It comes standard with 22 AWG silicone rubber leads (200 mm in length), capable of safely carrying a 4.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 8.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.

This product is typically used in applications such as temperature control for ultra-high-power industrial laser modules, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the flagship choice for ultra-high-power-density cooling requirements across extremely large surface areas.

🔷Thermoelectric Cooling Devices Product Features

1. Extra-large, symmetrical design with ample heat exchange area

The extra-large 40×80 mm rectangular package provides an extremely generous heat exchange area, making it suitable for large, ultra-high-power temperature control devices.

2. Ultra-high-power cooling with top-tier performance

With a maximum current of 4.0 A and a maximum power of 122 W, it achieves top-tier power density cooling within its extra-large package.

3. Deep cooling capability with a large temperature difference across the extra-large surface area

It achieves a maximum temperature difference of 70°C at an ultra-high power of 122 W, with the cold end reaching as low as approximately -30°C.

4. Three Chip Options for Flexible Adaptation

Offers three chip configurations: K10 (60°C), K18 (65°C), and K26 (70°C).

5. Low Internal Resistance Design for Efficient Power Conversion

With an internal resistance of only 5.97Ω, Joule heat loss is effectively controlled at a current of 4.0A, allowing more electrical energy to be converted into effective cooling capacity.

6. Ultra-thin Design, Saves Vertical Space

With a thickness of only 3.4–5.0 mm, it maintains an excellent slim profile even among ultra-high-power models.

7. Excellent Power Supply Compatibility

With a maximum voltage of 30.6 V, it is highly compatible with common industrial power supplies (30 V), telecommunications equipment power supplies, and other platforms.

8. High-Quality Substrate with Excellent Heat Dissipation Across an Extra-Large Area

A thick copper layer ensures uniform heat distribution and efficient heat dissipation across an extra-large area of 80 mm × 40 mm.

9. Exceptional Adaptability to High Assembly Pressures

The recommended assembly pressure of 8.0 kg (0.25 kg/cm²) ensures a tight bond with extra-large heat sinks.

10. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.

11. Bidirectional Temperature Control, Dual-Function Single Core

Reversing the current polarity activates heating mode, enabling bidirectional temperature regulation.

12. Zero Noise, Zero Vibration, Precision Operation

The all-solid-state design ensures completely silent and vibration-free operation.

🔷Peltier Elements  Product Show