🔷Thermoelectric Controller Product Drawing

🔷Thermal Generators Basic Performance Spec

🔷Thermoelectric Devices Additional Performance Spec

🔷Peltier Element Cooler Performance Curve

🔷Thermoelectric Generator Product Overview

The TEC1-33205 is a flagship industrial semiconductor cooling module designed for ultra-large-area, ultra-high-power, and high-voltage precision temperature control. With dimensions of 60 × 120 mm, it is currently one of the largest models in this series. Featuring an ultra-large rectangular symmetrical package design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring ultra-large-area temperature control and extremely high thermal loads, such as ultra-high-power industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling extremely high thermal loads.

This product is available in three crystal configurations—K16, K28, and K40—with thicknesses of 4.0 mm, 5.2 mm, and 6.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 39.8 V, a maximum current of 5.0 A, a maximum cooling power of 199 W, and an internal resistance of 6.22 Ω.

The extra-large 60×120mm rectangular package allows it to be embedded inside extra-large industrial equipment, high-power laser modules, and similar applications. While ensuring a maximum cooling temperature difference of 70°C and ultra-high cooling power of 199W, the 60mm width and 120mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the surface of extra-large loads. This product features a drive design rated for an ultra-high voltage of 39.8 V and a current of 5.0 A, making it highly compatible with common industrial power supplies (40 V) and telecommunications equipment power platforms, eliminating the need for complex power conversion. The high internal resistance of 6.22 Ω ensures precise current control, enabling the drive circuit to achieve high-precision constant-current regulation and thereby deliver stable temperature control. The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the 120 mm × 60 mm ultra-large surface area, preventing localized hot spots. It comes standard with 20 AWG silicone rubber leads (300 mm in length), capable of safely carrying a 5.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 18.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.

This product is typically used in applications such as temperature control for ultra-high-power, extra-large industrial laser modules; medical imaging equipment; temperature stabilization for industrial analytical instruments; heat dissipation for telecommunications base station equipment; industrial laser processing equipment; and large-scale medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving extra-large areas, high voltage, and ultra-high power.

🔷Thermoelectric Cooler Product Applications

1. Temperature Control for Ultra-High-Power, Extra-Large Industrial Laser Modules

Ultra-high-power, extra-large industrial semiconductor laser modules generate a significant amount of heat during operation, and temperature fluctuations directly affect the stability of the output wavelength and power. The TEC1-33205’s 60×120 mm extra-large surface area is compatible with the packaging of extra-large laser modules, providing uniform temperature control coverage along the 120 mm length. Its 199 W ultra-high power capacity quickly addresses thermal shock during laser startup, ensuring the stability of output wavelength and power.

2. Temperature Control for Medical Imaging Equipment

Core sensors and detectors in large medical imaging equipment (such as CT scanners, MRI auxiliary temperature control systems, and PET detectors) require a strictly controlled, constant-temperature environment to ensure imaging quality. The TEC1-33205 provides a large-area, low-noise, vibration-free temperature control solution. Its 60×120 mm surface area can cover large detector arrays, its 199 W power effectively manages heat generated by the detectors themselves, and its 39.8 V voltage is compatible with power supply platforms commonly used in medical equipment.

3. Temperature Control for Large Analytical Instruments

Detectors in scientific instruments such as large spectrophotometers, chromatographs, and thermal analyzers must operate under constant-temperature conditions to reduce dark current and improve the signal-to-noise ratio. The TEC1-33205 provides a stable, constant-temperature environment; its 199W power output effectively manages the heat generated by the detectors themselves; its extra-large coverage area ensures temperature consistency across all regions of the detector; and its vibration-free, noise-free solid-state operation is well-suited for noise-sensitive laboratory environments.

4. Temperature Control for Communication Base Station Equipment

Critical chips and power modules in large communication base stations and data center switching equipment generate concentrated heat during operation. The TEC1-33205 can be used for active cooling of these critical components. Its 39.8V voltage is fully compatible with common power supply platforms for communication equipment, and its 60×120mm surface area covers large heat-generating areas, while its 199W power output meets the cooling demands of ultra-high-power base station equipment.

5. Temperature Control for Industrial Laser Processing Equipment

Optical components in large industrial laser processing equipment are subject to thermal deformation during operation, which affects processing accuracy. The TEC1-33205 provides active temperature control; its ultra-high power of 199W effectively manages the substantial heat generated during high-power laser processing, maintaining a constant temperature for optical components and ensuring processing accuracy. An extremely high assembly pressure of 18.0 kg ensures a tight bond between the extra-large cooling plate and the heat sink, making it capable of withstanding the vibrations and shocks typical of industrial environments.

6. Temperature Control for Large Medical Diagnostic Equipment

Reaction modules in large medical devices, such as in vitro diagnostic (IVD) equipment and chemiluminescence analyzers, require a strictly controlled, constant-temperature environment. With its extra-large coverage area, maintenance-free operation, and stable performance, the TEC1-33205 is well-suited to meet the demands of medical equipment for long-term reliability and large-area temperature control.

🔷Peltier Cooler Work Principle

The TEC1-33205 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 332 pairs of semiconductor grains (the “332” in the model number denotes 332 pairs), representing an ultra-large-scale thermopile design—with an extremely high number of thermocouple pairs capable of generating significant temperature differences and cooling capacity at relatively low currents, providing ample heat pump capacity for temperature control of an extra-large 120mm × 60mm area. The 0.4 mm-thick oxygen-free copper layer ensures uniform heat diffusion across the 120 mm × 60 mm ultra-large area.

When a forward DC voltage (up to 39.8 V) is applied, a 5.0 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As a large number of charge carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot-end node releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.

This product is designed to operate at 39.8V and 5.0A, making it highly compatible with common 40V industrial power supply platforms. It requires no additional step-up or step-down circuits, simplifying system power supply design. The high internal resistance of 6.22 Ω facilitates precise control of the 5.0 A current at 39.8 V, reducing the precision requirements for the drive circuit and enabling high-precision constant-current control. The 0.4 mm thick copper layer helps heat from the hot end diffuse uniformly across the 120 mm × 60 mm extra-large surface area, preventing localized overheating and improving heat dissipation efficiency.

This product achieves a maximum temperature difference of 70°C at a hot-end temperature of 40°C (K40 model), meaning the cold end can reach as low as approximately -30°C. Achieving this level of deep cooling at an input power of 199 W ensures balanced energy efficiency. The extra-large 60 × 120 mm footprint allows it to fit snugly against oversized loads such as extra-large laser modules and industrial equipment. The large contact area and short heat transfer path effectively reduce the contact thermal resistance between the cold end and the load.