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The TEC1-33210 is the ultimate flagship industrial semiconductor cooling module designed for ultra-large-area, extreme high-power-density, high-voltage precision temperature control. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for top-tier, ultra-high-power industrial equipment, high-power laser modules, high-performance medical devices, and other applications requiring extensive thermal control over large areas and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-33210 | K10 | 60 | 3.11 | 39.8 | 10.0 | 398 | 60×120×3.4 |
| TEC1-33210 | K16 | 65 | 3.11 | 39.8 | 10.0 | 398 | 60×120×4.0 |
| TEC1-33210 | K22 | 70 | 3.11 | 39.8 | 10.0 | 398 | 60×120×4.6 |
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 18 AWG, L = 300 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 18.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
The TEC1-33210 is the ultimate flagship industrial semiconductor cooling module designed for ultra-large-area, extreme high-power-density, high-voltage precision temperature control. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for top-tier, ultra-high-power industrial equipment, high-power laser modules, high-performance medical devices, and other applications requiring extensive thermal control over large areas and handling extremely high thermal loads, it is the most powerful flagship model in the series.
This product is available in three crystal configurations—K10, K16, and K22—with thicknesses of 3.4 mm, 4.0 mm, and 4.6 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 39.8 V, a maximum current of 10.0 A, a maximum cooling power of 398 W, and an internal resistance of 3.11 Ω.
Its extra-large 60 × 120 mm rectangular package allows it to be embedded inside top-tier, high-power industrial equipment and and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and extreme power cooling up to 398W. The 60mm width and 120mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of very large-area loads. This product features a drive design rated for an ultra-high voltage of 39.8V and a current of 10.0A, making it highly compatible with common industrial power supplies (40V) and telecommunications equipment power platforms. The low internal resistance of 3.11Ω effectively controls Joule heating losses (I²R ≈ 311W) at 10.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 60 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone rubber leads (300 mm in length), capable of safely carrying the high current of 10.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 18.0 kg (0.25 kg/cm²), ensuring a tight fit between the extra-large cooling plate, the heat sink, and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for top-tier, ultra-high-power, extra-large industrial laser modules; heat dissipation for large industrial equipment; high-performance medical devices; and high-power communication base stations. It is the premier flagship choice for cooling applications requiring extreme power density in extra-large, high-surface-area spaces.
1. Temperature Control for Ultra-Large Industrial Laser Modules Operating at Maximum Power
Ultra-large industrial semiconductor laser modules operating at maximum power generate a significant amount of heat. The TEC1-33210’s 398W maximum power cooling capacity enables efficient temperature control across an extra-large 60×120mm area, stabilizing the laser temperature at the setpoint ±0.05°C. It is suitable for high-power laser processing, optical communications, and LIDAR systems.
2. Heat Dissipation for Large Industrial Equipment
High-power electronic components and power modules in large industrial equipment generate concentrated heat during operation. The TEC1-33210 can be mounted directly on the surface of these components; its 398W maximum power cooling capacity provides robust active cooling, reducing core temperatures by more than 25°C and enhancing equipment reliability and service life.
3. Temperature Control for High-Performance Medical Equipment
High-end medical imaging equipment and large in-vitro diagnostic devices require a strictly controlled, constant-temperature environment. The TEC1-33210 delivers robust cooling performance thanks to its extra-large coverage area, maintenance-free operation, and stable performance.
4. Heat Dissipation for High-Power Communication Base Stations
High-power communication components, such as 5G base stations and high-power transmitters, generate concentrated heat. The TEC1-33210 can be used for active cooling, and its 39.8V operating voltage is fully compatible with communication equipment power platforms.
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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