The TEC1-09903 is a semiconductor cooling module designed for precision temperature control of very large areas at moderate power levels. With dimensions of 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. It is optimized for industrial-grade laser modules, large medical and cosmetic devices, industrial analytical instruments, telecommunications base stations, and other equipment requiring temperature control over very large areas at moderate power levels. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Generator Product Drawing

🔷Thermoelectric Power Generator Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-09903 | K20 | 60 | 3.12 | 12.0 | 3.0 | 36 | 30×60×4.4 |
| TEC1-09903 | K30 | 65 | 3.12 | 12.0 | 3.0 | 36 | 30×60×5.4 |
| TEC1-09903 | K40 | 70 | 3.12 | 12.0 | 3.0 | 36 | 30×60×6.4 |
🔷Element Peltier Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 22 AWG, L = 100 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 4.5 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Peltier Cooling Element Performance Curve

🔷TEC Cooling System Product Overview
The TEC1-09903 is a semiconductor cooling module designed for precision temperature control of very large areas at moderate power levels. With dimensions of 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. It is optimized for industrial-grade laser modules, large medical and cosmetic devices, industrial analytical instruments, telecommunications base stations, and other equipment requiring temperature control over very large areas at moderate power levels.
This product is available in three crystal configurations—K20, K30, and K40—with thicknesses of 4.4 mm, 5.4 mm, and 6.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 12.0 V, a maximum current of 3.0 A, a maximum cooling power of 36 W, and an internal resistance of 3.12 Ω.
The extra-large 30×60mm rectangular package allows it to be embedded within large laser modules, medical devices, industrial equipment, and other applications. While ensuring a maximum cooling temperature difference of 70°C and a cooling power of 36W, the 30mm width and 60mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the large surface area of the load. This product is designed to operate at 12.0V and 3.0A, making it highly compatible with common industrial power supplies (12V), telecommunications equipment power supplies, and automotive power platforms, eliminating the need for complex power conversion. The 3.12Ω internal resistance provides moderate current control sensitivity, facilitating precise constant-current regulation by the drive circuit. The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the 60 mm × 30 mm surface area, preventing localized hot spots. It comes standard with 22 AWG silicone-coated leads (100 mm in length), capable of safely carrying a 3.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration.
This product is typically used in applications such as temperature control for large industrial laser modules, large medical and cosmetic equipment, temperature stabilization for industrial analytical instruments, heat dissipation for telecommunications base station equipment, industrial laser processing equipment, and large medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving medium power and very large surface areas.
🔷Thermoelectric Cooling Device Product Features
1. Extra-large, symmetrical design with ample heat exchange area
The extra-large 30×60 mm rectangular package provides an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of large-area loads, making it suitable for large temperature-controlled equipment.
2. Medium-power cooling with ample capacity
With a maximum current of 3.0 A and a maximum power of 36 W, this unit delivers sufficient cooling capacity within its large-area package, making it suitable for large equipment with medium-to-high thermal loads.
3. Deep-cooling Capability, Large Surface Area with High Temperature Differential
At 36W power, it achieves a maximum temperature differential of 70°C, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep cooling.
4. Three Chip Options for Flexible Adaptation
Three chip configurations are available: K20 (60°C), K30 (65°C), and K40 (70°C). Users can flexibly select the appropriate model based on their target cooling depth.
5. Three Thickness Options to Suit Different Spaces
Thicknesses are 4.4 mm, 5.4 mm, and 6.4 mm. the K40 model measures 6.4 mm thick, providing ample space for the crystal grains to facilitate deep cooling down to 70°C over an extra-large area.
6. Excellent Power Supply Compatibility
With a maximum voltage of 12.0V, it is highly compatible with common industrial power supplies (12V), telecommunications equipment power supplies, and automotive power supplies, among other platforms. It can be directly integrated into various industrial equipment power architectures without the need for complex power conversion.
7. High-Quality Substrate for Uniform Heat Dissipation Across an Extra-Large Area
The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.4 mm). The thick copper layer ensures that heat is evenly distributed and rapidly dissipated across the extra-large 60 mm × 30 mm surface area.
8. High Adaptability to Assembly Pressure
The recommended assembly pressure is 4.5 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate makes tight contact with both the heat sink and the surface being cooled, effectively reducing contact thermal resistance.
9. Sealed Protection, Strong Environmental Adaptability
The perimeter is sealed with 704 silicone rubber, providing excellent moisture, dust, and shock resistance, making it suitable for complex industrial environments with high humidity and significant temperature fluctuations.
10. Bidirectional Temperature Control, Dual-Function Single Core
Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.
11. Zero Noise, Zero Vibration, Precision Operation
The all-solid-state design ensures completely silent and vibration-free operation, making it ideal for high-precision industrial applications with strict noise and vibration requirements.
🔷Thermoelectric Cooling Element Product Show



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The TEC1-19503 is a semiconductor cooling module designed for precision temperature control of extremely large areas, high power, and high voltage. With dimensions of 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
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