🔷Thermoelectric Peltier Module Product Drawing

🔷Cooling Module Basic Performance Spec

🔷Tec Thermoelectric Cooler Additional Performance Spec

🔷Semiconductor Cooler Performance Curve

🔷TEC Peltier Module Product Overview

The TEC1-09906 is a flagship semiconductor cooling module designed for ultra-large-area, ultra-high-power-density cooling. With dimensions of 30 × 60 mm and a large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. It is optimized for equipment requiring extensive temperature control over a large area and handling extremely high thermal loads, such as ultra-high-power industrial laser modules, large medical and cosmetic devices, and high-power industrial equipment.

This product is available in three crystal configurations—K10, K18, and K26—with thicknesses of 3.4 mm, 4.2 mm, and 5.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 12.0 V, a maximum current of 6.0 A, a maximum cooling power of 72 W, and an internal resistance of just 1.56 Ω.

The extra-large 30×60mm rectangular package allows it to be embedded inside ultra-high-power laser modules, large industrial equipment, and other applications—while ensuring a maximum cooling temperature difference of 70°C and extreme high-power cooling up to 72W, the 30mm width and 60mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the large surface area of the load. This product is designed to operate at 12.0 V and 6.0 A, making it highly compatible with common industrial power supplies (12 V) and telecommunications equipment power platforms. The ultra-low internal resistance of 1.56 Ω effectively controls Joule heating losses (I²R ≈ 56.2 W) at a high current of 6.0 A, allowing more electrical energy to be converted into effective cooling capacity. The substrate is manufactured using a sintering process that combines 96% alumina ceramic (0.76 mm) with 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the 60 mm × 30 mm ultra-large surface area. It comes standard with 20 AWG silicone rubber leads (200 mm in length), capable of safely carrying the 6.0 A high current. Sealed with 704 silicone rubber around the perimeter, it operates in a fully solid-state, noise-free, and vibration-free manner.

This product is typically used in applications such as temperature control for ultra-high-power industrial laser modules, large-scale medical and cosmetic equipment, temperature stabilization for industrial analytical instruments, and heat dissipation for telecommunications base station equipment. It is the flagship choice for ultra-high-power-density cooling requirements in very large-area applications.

🔷Peltier Heater Cooler Product Applications

1. Temperature Control for Large Industrial Laser Modules

Large industrial semiconductor laser modules generate a significant amount of heat during operation, and temperature fluctuations directly affect the stability of the output wavelength and power. The TEC1-09903’s 30×60 mm extra-large surface area is compatible with the packaging of large laser modules, providing uniform temperature control coverage along the 60 mm length. Its 36 W power rating enables rapid response to thermal shock during laser startup, ensuring stable output wavelength and power.

2. Temperature Control for Large Medical and Aesthetic Devices

The cold/hot therapy probes of large medical aesthetic devices (such as large-scale photorejuvenation systems and medical-grade cryolipolysis devices) require extensive contact area and precise temperature control. The TEC1-09903 achieves alternating hot and cold modes by switching the current direction; its 30×60 mm ultra-large surface area provides greater contact coverage, while its 36 W power ensures rapid attainment of the set temperature, thereby enhancing treatment efficacy and user experience.

3. Temperature Control for Large Analytical Instruments

Detectors in scientific instruments—such as large spectrophotometers, chromatographs, and thermal analyzers—must operate under constant-temperature conditions to reduce dark current and improve the signal-to-noise ratio. The TEC1-09903 provides a stable, constant-temperature environment; its ultra-large coverage area effectively ensures temperature consistency across all regions of the detector, and its vibration-free, noise-free solid-state operation is well-suited for noise-sensitive laboratory environments.

4. Temperature Control for Communication Base Station Equipment

Critical chips in equipment such as communication base stations and large optical modules generate concentrated heat during operation. The TEC1-09903 can be used for active cooling of these critical components. Its 12.0V voltage is fully compatible with common power supply platforms for communication equipment, its 30×60mm surface area covers large heat-generating areas, and its 36W power output meets the thermal management requirements of base station equipment.

5. Temperature Control for Industrial Laser Processing Equipment

Optical components in large industrial laser processing equipment are subject to thermal deformation during operation, which affects processing accuracy. The TEC1-09903 provides active temperature control to maintain a constant temperature for optical components, ensuring processing accuracy. Its high assembly pressure of 4.5 kg ensures a tight seal between the extra-large cooling plate and the heat sink, making it suitable for the vibrations and shocks typical of industrial environments.

6. Temperature Control for Large Medical Diagnostic Equipment

Reaction modules in large medical devices, such as in vitro diagnostic (IVD) equipment and chemiluminescence analyzers, require a strictly controlled, constant-temperature environment. With its large coverage area, maintenance-free operation, and stable performance, the TEC1-09903 is well-suited to meet the demands of medical equipment for long-term reliability and large-area temperature control.

🔷Advanced TEC Installation and Usage Recommendations

Assembly Pressure: 4.5 kg (0.25 kg/cm²) is recommended. Extra-large-area cooling plates require higher assembly pressure to ensure a tight fit between the heat sink and the surface being cooled, effectively reducing thermal contact resistance. It is recommended to apply a uniform layer of high-performance thermal grease (thermal conductivity > 3 W/m·K) to both surfaces, with a thickness of 0.05–0.1 mm.

Installation Orientation: The 30×60 mm extra-large-area TEC has a specific dimensional orientation. During installation, ensure that the 60 mm long side aligns with the length of the device being cooled to achieve optimal thermal contact coverage.

Hot-end Cooling Requirements: With a power dissipation of 36 W—which is moderately high—we recommend using a large extruded aluminum heat sink measuring at least 35 × 65 × 20 mm, paired with a fan of moderate airflow (airflow > 10 CFM), or utilizing the device’s metal enclosure for heat dissipation to meet the requirements.

Power Supply Requirements: Maximum voltage 12.0V, maximum current 3.0A. We recommend using a regulated power supply rated at 12V/3.5A or higher (industrial, telecommunications, or automotive power supplies are all acceptable). Recommended power supply ripple: < 50mV.

Lead Wires: Comes standard with 22 AWG silicone-coated wires, which fully meet the 3.0A requirement and can be used directly.

Current Limitation: Do not exceed 3.0A. It is recommended to install a 3.5A self-resetting fuse in series for overcurrent protection.

Condensation Prevention Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation, and apply conformal coating to the lead solder joints.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.

Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.