The TEC1-13910 is a flagship industrial semiconductor cooling module designed for ultra-large-area, low-voltage, high-power-density precision temperature control. With dimensions of 80 × 120 mm, it is one of the largest models in the series. Featuring an ultra-large, rectangular, symmetrical package design, it provides an exceptionally large heat exchange area and is optimized for equipment requiring extensive temperature control and extremely high thermal loads, such as large industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring extensive temperature control over a large area and capable of handling extremely high thermal loads. It is🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw the most powerful flagship model in the series.

| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-13910 | K28 | 60 | 1.29 | 16.6 | 10.0 | 166 | 80×120×5.7 |
| TEC1-13910 | K36 | 65 | 1.29 | 16.6 | 10.0 | 166 | 80×120×6.5 |
| TEC1-13910 | K44 | 70 | 1.29 | 16.6 | 10.0 | 166 | 80×120×7.3 |
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 18 AWG, L = 300 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 24.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |

The TEC1-13910 is a flagship industrial semiconductor cooling module designed for ultra-large-area, low-voltage, high-power-density precision temperature control. With dimensions of 80 × 120 mm, it is one of the largest models in the series. Featuring an ultra-large, rectangular, symmetrical package design, it provides an exceptionally large heat exchange area and is optimized for equipment requiring extensive temperature control and extremely high thermal loads, such as large industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring extensive temperature control over a large area and capable of handling extremely high thermal loads. It is the most powerful flagship model in the series.
This product is available in three chip configurations—K28, K36, and K44—with thicknesses of 5.7 mm, 6.5 mm, and 7.3 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 16.6 V, a maximum current of 10.0 A, a maximum cooling power of 166 W, and an internal resistance of just 1.29 Ω.
The extra-large 80×120mm rectangular package allows it to be embedded inside large industrial equipment, ultra-high-power laser modules, and similar applications—while ensuring a maximum cooling temperature difference of 70°C and high-power cooling of 166W, the 80mm width and 120mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the surface of very large loads. This product features a 16.6V low-voltage, 10.0A current drive design, making it compatible with common industrial power supplies (12V/24V requiring conversion) and telecommunications equipment power platforms. The ultra-low internal resistance of 1.29Ω effectively controls Joule heat loss (I²R ≈ 129W) at a current of 10.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 80 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone-coated leads (300 mm in length), capable of safely carrying the high current of 10.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 24.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for large industrial laser modules, medical imaging equipment, temperature stabilization for industrial analytical instruments, heat dissipation for telecommunications base station equipment, industrial laser processing equipment, and large-scale medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving extra-large, high-area spaces with low voltage and high power density.
1. Temperature Control for Large Industrial Laser Modules
Large industrial semiconductor laser modules generate significant heat during operation, and temperature fluctuations directly affect the stability of output wavelength and power. The TEC1-13910’s extra-large 80×120 mm surface area is compatible with the packaging of large laser modules, providing uniform temperature control coverage along the 120 mm length. Its high power rating of 166 W enables rapid response to thermal shocks during laser startup, ensuring the stability of output wavelength and power.
2. Temperature Control for Medical Imaging Equipment
Core sensors and detectors in large medical imaging equipment (such as CT scanners, MRI auxiliary temperature control systems, and PET detectors) require a strictly controlled, constant-temperature environment to ensure imaging quality. The TEC1-13910 provides a large-area, low-noise, vibration-free temperature control solution. Its 80×120 mm surface area covers large detector arrays, its 166 W power effectively manages heat generated by the detectors themselves, and its 16.6 V voltage is compatible with power supply platforms commonly used in medical equipment.
3. Temperature Control for Large Analytical Instruments
Detectors in scientific instruments such as large spectrophotometers, chromatographs, and thermal analyzers must operate under constant-temperature conditions to reduce dark current and improve the signal-to-noise ratio. The TEC1-13910 provides a stable, constant-temperature environment; its 166W power output effectively manages the heat generated by the detectors themselves; and its extra-large coverage area ensures temperature consistency across all regions of the detector. Its vibration-free, noise-free solid-state operation is well-suited for noise-sensitive laboratory environments.
4. Temperature Control for Communication Base Station Equipment
Critical chips and power modules in large telecommunications base stations and data center switching equipment generate concentrated heat during operation. The TEC1-13910 can be used for active cooling of these critical components; its 16.6V voltage can be adapted via a power supply converter, its 80×120 mm surface area covers large heat-generating areas, and its 166W power output meets the thermal management requirements of base station equipment.
5. Temperature Control for Industrial Laser Processing Equipment
Optical components in large industrial laser processing equipment are subject to thermal deformation during operation, which affects processing accuracy. The TEC1-13910 provides active temperature control; its high power output of 166W effectively manages the substantial heat generated during high-power laser processing, maintaining a constant temperature for optical components and ensuring processing accuracy. An extremely high assembly pressure of 24.0 kg ensures a tight seal between the extra-large cooling plate and the heat sink, making it suitable for the vibrations and shocks typical of industrial environments.
6. Temperature Control for Large Medical Diagnostic Equipment
Reaction modules in large medical devices, such as in vitro diagnostic (IVD) equipment and chemiluminescence analyzers, require a strictly controlled, constant-temperature environment. With its extra-large coverage area, maintenance-free operation, and stable performance, the TEC1-13910 is well-suited to meet the demands of medical equipment for long-term reliability and large-area temperature control.
Assembly Pressure: 24.0 kg (0.25 kg/cm²) is recommended. Extra-large cooling plates require extremely high assembly pressure to ensure a tight fit with the heat sink and the surface being cooled, thereby effectively reducing thermal contact resistance. It is recommended to apply a uniform layer of high-performance thermal grease (thermal conductivity > 5 W/m·K) to both surfaces, with a thickness of 0.05–0.1 mm.
Installation Orientation: The 80×120 mm extra-large TEC has a specific dimensional orientation. During installation, ensure that the 120 mm long side aligns with the length of the device being cooled to achieve optimal thermal contact coverage.
Hot-End Cooling Requirements (Important): With a high power dissipation of 166 W, it is recommended to use a large extruded aluminum heat sink measuring at least 85 × 125 × 55 mm, paired with a high-airflow fan (airflow > 40 CFM) or a heat pipe/liquid cooling solution to ensure timely heat dissipation from the hot end. The cooling efficiency of the hot end directly determines the lowest achievable temperature at the cold end.
Power Supply Requirements: Maximum voltage 16.6V, maximum current 10.0A. We recommend using a regulated power supply rated at 16.6V/12A or higher (can be adapted via a 24V step-down or 12V step-up converter). Recommended power supply ripple: < 50mV.
Lead Wires: Standard configuration includes 18 AWG silicone-coated wires (300 mm in length), rated for a safe current carrying capacity of 10.0 A, meeting the wiring requirements for extra-large equipment.
Current Limitation: Do not exceed 10.0A; it is recommended to connect a 12A self-resetting fuse in series for overcurrent protection.
Condensation Prevention Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation; coat the lead solder joints with conformal coating.
Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.
Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.
A Peltier cooler uses semiconductor technology without refrigerant or mechanical compressors. It provides compact size, precise temperature control and low maintenance compared with traditional refrigeration systems.
The service life depends on operating conditions, thermal management design and working environment. With proper heat dissipation and correct operation, TEC modules can provide long-term stable performance.
Yes. We support bulk orders for distributors, OEM manufacturers and industrial customers, providing stable supply capacity and customized production services.
We provide professional thermoelectric cooling solutions with manufacturing experience, customized service capability and support for different industrial applications.
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