The TEC1-13925 is the ultimate flagship industrial semiconductor cooling module designed for ultra-large-area, low-voltage, super-extreme power density precision temperature control. Measuring 80 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring ultra-high power density, high-power laser modules, high-performance medical devices, and other applications demanding extensive thermal control and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Peltier Product Drawing

🔷TEG Module Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-13925 | K10 | 60 | 0.52 | 16.6 | 25.0 | 415 | 80×120×3.9 |
| TEC1-13925 | K20 | 65 | 0.52 | 16.6 | 25.0 | 415 | 80×120×4.9 |
| TEC1-13925 | K30 | 70 | 0.52 | 16.6 | 25.0 | 415 | 80×120×5.9 |
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 18 AWG, L = 300 mm (dual wires) |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 24.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |

The TEC1-13925 is the ultimate flagship industrial semiconductor cooling module designed for ultra-large-area, low-voltage, super-extreme power density precision temperature control. Measuring 80 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring ultra-high power density, high-power laser modules, high-performance medical devices, and other applications demanding extensive thermal control and handling extremely high thermal loads, it is the most powerful flagship model in the series.
This product is available in three crystal configurations—K10, K20, and K30—with thicknesses of 3.9 mm, 4.9 mm, and 5.9 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 16.6 V, a maximum current of 25.0 A, a maximum cooling power of 415 W, and an internal resistance of just 0.52 Ω.
Its extra-large 80 × 120 mm rectangular package allows it to be embedded inside large industrial equipment and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and cooling for ultra-high power up to 415W. The 80mm width and 120mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of extremely large-area loads. This product features a 16.6V low-voltage, 25.0A drive design, making it compatible with common industrial power supplies (12V/24V requiring conversion) and telecommunications equipment power supply platforms. With an ultra-low internal resistance of 0.52Ω—the lowest in this series—Joule heat loss (I²R ≈ 325W) at 25.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 80 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone-coated leads (300 mm in length, twin-wire configuration), capable of safely handling the high current of 25.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure of up to 24.0 kg (0.25 kg/cm²) ensures that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for large industrial laser modules operating at ultra-high power levels, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the ultimate flagship choice for cooling applications requiring extreme power density in ultra-large, high-surface-area spaces.
1. Temperature Control for Large-Scale Industrial Laser Modules with Ultra-High Power
Large-scale industrial semiconductor laser modules with ultra-high power generate a significant amount of heat during operation. The TEC1-13925’s 415W ultra-high-power cooling capacity enables efficient temperature control across an 80×120mm ultra-large area, stabilizing the laser temperature at the setpoint ±0.05°C. It is suitable for ultra-high-power laser processing, optical communications, and LIDAR systems.
2. Heat Dissipation for Large Industrial Equipment
High-power electronic components and power modules in large industrial equipment generate concentrated heat during operation. The TEC1-13925 can be mounted directly on the surface of these components; its 415W super-high-power cooling capability provides robust active cooling, reducing core temperatures by more than 25°C and enhancing equipment reliability and lifespan.
3. Temperature Control for High-Performance Medical Equipment
High-end medical imaging equipment and large in-vitro diagnostic devices require a strictly controlled, constant-temperature environment. The TEC1-13925 delivers powerful cooling capabilities thanks to its extra-large coverage area, maintenance-free operation, and stable performance.
4. Heat Dissipation for High-Power Communication Base Stations
High-power communication devices, such as 5G base stations and high-power transmitters, generate concentrated heat. The TEC1-13925 can be used for active cooling, and its 16.6V operating voltage can be adapted via a power supply converter.

The TEC1-13925 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal lead frames to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive ceramic substrates. With 139 pairs of crystals, this is a large-scale thermoelectric stack design featuring a high number of thermocouple pairs, capable of generating a significant temperature difference and cooling capacity at moderate current levels.
When a forward DC voltage (up to 16.6 V) is applied, a high current of 25.0 A drives carriers to exchange energy at the PN junction interface—the cold end absorbs phonon energy and cools, while the hot end releases energy and heats up. Heat is continuously “pumped” from the cold end to the hot end.
The ultra-low internal resistance of 0.52 Ω is a core advantage of this product; it is the model with the lowest internal resistance in this series, effectively controlling Joule heat loss (I²R ≈ 325 W) at a high current of 25.0 A. The 0.4 mm thick copper layer helps evenly dissipate the high heat load of 415 W across the extra-large 120 mm × 80 mm surface area. This product achieves a maximum temperature difference of 70 °C (K30 model) when the hot end temperature is 40 °C, while the cold end can reach as low as approximately -30 °C.
TEC1-09705 is a 30×30mm semiconductor thermoelectric cooling module that uses the Peltier effect to achieve cooling and heating functions. It is suitable for applications requiring compact size and precise temperature control.
TEC1-09705 features a compact structure, fast thermal response, no moving parts, low noise operation and reliable performance. It is widely used in electronic cooling, laser cooling and temperature control systems.
The operating voltage of TEC1-09705 depends on the specific working conditions and application requirements. Customers can select suitable voltage and current parameters according to their system design.
Yes. By changing the direction of DC current, TEC1-09705 can switch between cooling mode and heating mode, making it suitable for bidirectional temperature control applications.
The selection of a Peltier cooler depends on several factors, including cooling capacity, operating voltage, current, temperature difference, installation space and heat dissipation conditions.
Yes. A proper heat sink or thermal management system is required on the hot side of the thermoelectric cooler to effectively release heat and maintain stable cooling performance.
Yes. As a professional peltier cooler manufacturer, we provide OEM and custom solutions, including customized dimensions, wire specifications, voltage, current and performance requirements.
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The TEC1-13910 is a flagship industrial semiconductor cooling module designed for ultra-large-area, low-voltage, high-power-density precision temperature control. With dimensions of 80 × 120 mm, it is one of the largest models in the series. Featuring an ultra-large, rectangular, symmetrical package design, it provides an exceptionally large heat exchange area and is optimized for equipment requiring extensive temperature control and extremely high thermal loads, such as large industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring extensive temperature control over a large area and capable of handling extremely high thermal loads. It is🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw the most powerful flagship model in the series.