TEC1-13930 Thermoelectric Power Generator 80*120mm

The TEC1-13930 is the ultimate flagship industrial semiconductor cooling module designed for ultra-large-area, low-voltage, super-extreme power density precision temperature control. Measuring 80 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring ultra-high power density, high-power laser modules, high-performance medical devices, and other applications demanding extensive thermal control and handling extremely high thermal loads, it is the most powerful flagship model in the series.
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🟨 MOQ:1 Pcs
🟥 Fast Delivery:2-15 Days
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⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw

🔷Thermoelectric Cooling Device Product Drawing




🔷Thermoelectric Cooling Element Basic Performance Spec

Type ModeChip ModelΔTmax (°C)ACR (Ω)Umax (V)Imax (A)Pmax (W)Size (mm)
TEC1-13930K10600.4316.630.049880×120×3.9
TEC1-13930K18650.4316.630.049880×120×4.7
TEC1-13930K26700.4316.630.049880×120×5.5



🔷Thermoelectric Generation Additional Performance Spec

ParameterSpecification
Substrate Material96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process
Lead Wire SpecificationSilicone wire, 18 AWG, L = 300 mm (dual wires)
Terminal SpecificationNot included as standard; available upon request
Assembly Pressure24.0 kg (0.25 kg/cm²)
Packaging StandardPolystyrene (PS) foam box
Sealant Material704 silicone rubber sealant
Maximum Temperature ResistanceBismuth-tin eco-friendly solder, melting point 138°C
Storage EnvironmentTemperature < 120°C, Humidity < 60% Rh




🔷Thermoelectric Generator Modules Performance Curve

🔷Thermo Cooler Product Overview

The TEC1-13930 is the ultimate flagship industrial semiconductor cooling module designed for ultra-large-area, low-voltage, super-extreme power density precision temperature control. Measuring 80 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment requiring ultra-high power density, high-power laser modules, high-performance medical devices, and other applications demanding extensive thermal control and handling extremely high thermal loads, it is the most powerful flagship model in the series.


This product is available in three crystal configurations—K10, K18, and K26—with thicknesses of 3.9 mm, 4.7 mm, and 5.5 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 16.6 V, a maximum current of 30.0 A, a maximum cooling power of 498 W, and an internal resistance of just 0.43 Ω.


Its extra-large 80 × 120 mm rectangular package allows it to be embedded inside large industrial equipment and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and cooling for ultra-high power up to 498W. The 80mm width and 120mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of extremely large-area loads. This product features a 16.6V low-voltage, 30.0A drive design, making it compatible with common industrial power supplies (12V/24V requiring conversion) and telecommunications equipment power supply platforms. With an ultra-low internal resistance of 0.43Ω—the lowest in this series—Joule heat loss (I²R ≈ 387W) at 30.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 80 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone-coated leads (300 mm in length, twin-wire configuration), capable of safely handling the high current of 30.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure of up to 24.0 kg (0.25 kg/cm²) ensures that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.


This product is typically used in applications such as temperature control for large industrial laser modules operating at ultra-high power levels, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the ultimate flagship choice for cooling applications requiring extreme power density in ultra-large, high-surface-area spaces.




🔷Peltier Heater Product Features

1. Extra-large, symmetrical design with ample heat exchange area

The extra-large 80×120 mm rectangular package is one of the largest models in this series, providing an extremely generous heat exchange area that is suitable for large, ultra-high-power temperature control equipment.


2. Super-Extreme-Power Cooling, Top-Tier Performance

With a maximum current of 30.0 A and a maximum power of 498 W, it achieves top-tier power density cooling within its extra-large, high-surface-area package, making it the most powerful flagship model in the series.


3. Deep Cooling Capability: Extra-Large Surface Area with High Temperature Differential

It achieves a maximum temperature differential of 70°C at 498W of super-extreme power, with the cold end reaching as low as approximately -30°C.


4. Three Chip Options for Flexible Adaptation

Offers three chip configurations: K10 (60°C), K18 (65°C), and K26 (70°C).


5. Ultra-Low Internal Resistance Design for Efficient Power Conversion

With an internal resistance of just 0.43Ω, it is the model with the lowest internal resistance in this series. At a high current of 30.0A, Joule heating losses are effectively controlled, allowing more electrical energy to be converted into effective cooling capacity.


6. Ultra-thin Design, Saves Vertical Space

With a thickness of only 3.9–5.5 mm, it maintains an excellent slim profile among ultra-high-power models.


7. Low-Voltage, High-Current Design, Excellent System Compatibility

With a maximum voltage of 16.6 V and a maximum current of 30.0 A, it can be adapted via step-down or step-up conversion on common power supply platforms, making it suitable for industrial applications requiring low-voltage, high-current drive.


8. High-Quality Substrate with Excellent Heat Dissipation Across an Extra-Large Area

A thick copper layer ensures uniform heat distribution and efficient heat dissipation across an extra-large area of 120 mm × 80 mm.


9. Dual-Wire Lead Design for Safe 30.0 A Current Carrying Capacity

Comes standard with 18 AWG silicone-coated wires (300 mm long, dual-wire configuration) to meet high-current transmission and large-scale equipment wiring requirements, reducing the current-carrying load on each individual wire.


10. Exceptional Adaptability to Assembly Pressure

Recommended assembly pressure of 24.0 kg (0.25 kg/cm²) ensures tight contact with the extra-large heat sink.


11. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.


12. Bidirectional Temperature Control, Dual-Function Single Core

Reversing the current polarity activates heating mode, enabling bidirectional temperature regulation.


13. Zero Noise, Zero Vibration, Precision Operation

Fully solid-state construction ensures completely silent and vibration-free operation.



🔷TEC Peltier Product Show

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