🔷Thermoelectric Generator Product Drawing

🔷Thermoelectric Cooler Basic Performance Spec

🔷Peltier Cooler Additional Performance Spec

🔷Peltier Module Performance Curve

🔷TEC Cooler Product Overview

The TEC1-19504 is a flagship semiconductor cooling module designed for ultra-large-area, high-power, industrial-grade precision temperature control. With dimensions of 60 × 120 mm, it is one of the largest models in the series. Featuring an ultra-large, rectangular, symmetrical package design, it provides an exceptionally large heat exchange area and is optimized for equipment requiring extensive temperature control and high thermal loads, such as ultra-large industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling high thermal loads.

This product is available in three crystal configurations—K38, K42, and K46—with thicknesses of 6.2 mm, 6.6 mm, and 7.0 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 4.0 A, a maximum cooling power of 96 W, and an internal resistance of 4.68 Ω.

The extra-large 60×120mm rectangular package allows it to be embedded within extra-large industrial equipment, high-power laser modules, and similar applications. While ensuring a maximum cooling temperature difference of 70°C and high-power cooling of 96W, the 60mm width and 120mm length provide an extremely generous heat exchange area, facilitating the uniform transfer of cooling capacity to the surface of extra-large loads. This product features a 24V high-voltage, 4.0A current drive design, making it highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms. The 4.68Ω internal resistance keeps Joule heat loss (I²R ≈ 74.9W) at a reasonable level when operating at 4.0A, allowing more electrical energy to be converted into effective cooling capacity. The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat diffusion across the 120 mm × 60 mm ultra-large surface area, preventing localized hot spots. It comes standard with 18 AWG silicone rubber leads (300 mm in length), capable of safely carrying a 4.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 15.0 kg (0.25 kg/cm²), ensuring that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.

This product is typically used in applications such as temperature control for extra-large industrial laser modules, medical imaging equipment, temperature stabilization for industrial analytical instruments, heat dissipation for telecommunications base station equipment, industrial laser processing equipment, and large-scale medical diagnostic equipment. It is the ideal choice for precision temperature control requirements involving extra-large, high-voltage, high-power applications with extensive surface areas.

🔷Thermoelectric Cooler Peltier Product Applications

1. Temperature Control for Extra-Large Industrial Laser Modules

Extra-large industrial semiconductor laser modules generate a significant amount of heat during operation, and temperature fluctuations directly affect the stability of the output wavelength and power. The TEC1-19504’s 60×120 mm ultra-large surface area is compatible with the packaging of ultra-large laser modules, providing uniform temperature control coverage along the 120 mm length. Its 96 W power rating enables rapid response to thermal shock during laser startup, ensuring the stability of output wavelength and power.

2. Temperature Control for Medical Imaging Equipment

Core sensors and detectors in large medical imaging equipment (such as CT scanners, MRI auxiliary temperature control systems, and PET detectors) require a strictly controlled, constant-temperature environment to ensure imaging quality. The TEC1-19504 provides a large-area, low-noise, vibration-free temperature control solution. Its 60 × 120 mm surface area covers large detector arrays, and its 96 W power effectively manages heat generated by the detectors themselves. The 24 V operating voltage is compatible with common power supply platforms used in medical equipment.

3. Temperature Control for Large Analytical Instruments

Detectors in scientific instruments such as large spectrophotometers, chromatographs, and thermal analyzers must operate under constant-temperature conditions to reduce dark current and improve the signal-to-noise ratio. The TEC1-19504 provides a stable, constant-temperature environment; its 96W power rating effectively manages the heat generated by the detectors themselves; its extra-large coverage area ensures temperature consistency across all regions of the detector; and its vibration-free, noise-free solid-state operation is well-suited for noise-sensitive laboratory environments.

4. Temperature Control for Communication Base Station Equipment

Critical chips and power modules in large telecommunications base stations and data center switching equipment generate concentrated heat during operation. The TEC1-19504 can be used for active cooling of these critical components. Its 24.0V voltage is fully compatible with common power supply platforms for telecommunications equipment, its 60×120mm surface area covers large heat-generating areas, and its 96W power output meets the thermal management requirements of base station equipment.

5. Temperature Control for Industrial Laser Processing Equipment

Optical components in large-scale industrial laser processing equipment are subject to thermal deformation during operation, which affects processing accuracy. The TEC1-19504 provides active temperature control; its 96W power effectively manages the heat generated during laser processing, maintaining a constant temperature for optical components and ensuring processing accuracy. An extremely high assembly pressure of 15.0 kg ensures a tight bond between the extra-large cooling plate and the heat sink, making it suitable for the vibrations and shocks typical of industrial environments.

6. Temperature Control for Large Medical Diagnostic Equipment

Reaction modules in large medical devices, such as in vitro diagnostic (IVD) equipment and chemiluminescence analyzers, require a strictly controlled, constant-temperature environment. With its extra-large coverage area, maintenance-free operation, and stable performance, the TEC1-19504 is well-suited to meet the demands of medical equipment for long-term reliability and large-area temperature control.

🔷Peltier Cooling Module Work Principle

The TEC1-19504 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 195 pairs of crystals (the “195” in the model number refers to 195 pairs of crystals), representing an ultra-large-scale thermopile design—with a high number of thermocouple pairs, it can generate a large temperature difference and cooling capacity at moderate currents, providing sufficient heat pump capacity for temperature control of an extra-large 120mm × 60mm area. The 0.4 mm thick oxygen-free copper layer ensures uniform heat diffusion across the 120 mm × 60 mm ultra-large surface area.

When a forward DC voltage (up to 24.0 V) is applied, a 4.0 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As a large number of charge carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot-end node releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.

This product is designed to operate at 24.0V and 4.0A, making it highly compatible with common 24V industrial power supply platforms. It requires no additional step-up or step-down circuits, simplifying system power supply design. The internal resistance of 4.68Ω keeps Joule heating (I²R ≈ 74.9W) within a reasonable range, allowing more electrical energy to be converted into effective cooling capacity. The 0.4mm-thick copper layer helps heat from the hot end diffuse uniformly across the 120mm × 60mm extra-large surface area, preventing localized overheating and improving heat dissipation efficiency.

At a hot-end temperature of 40°C, this product achieves a maximum temperature difference of 70°C (K46 model), meaning the cold end can reach as low as approximately -30°C. Achieving this level of deep cooling at an input power of 96W demonstrates balanced energy efficiency. The extra-large 60×120mm design allows it to fit snugly against oversized loads such as large laser modules and industrial equipment; the large contact area and short heat transfer path effectively reduce the contact thermal resistance between the cold end and the load.