🔷TEC Peltier Product Drawing

🔷TEC Module Basic Performance Spec

🔷Thermoelectric Cooler Module Additional Performance Spec

🔷Thermoelectric Peltier Module Performance Curve

🔷Cooling Module Product Overview

The TEC1-19510 is the ultimate flagship industrial semiconductor heat sink designed for cooling extremely large areas at the highest possible power density. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series.

This product is available in three chip configurations—K16, K28, and K40—with thicknesses of 4.0 mm, 5.2 mm, and 6.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 10.0 A, a maximum cooling power of 240 W, and an internal resistance of just 1.87 Ω.

Its extra-large 60 × 120 mm rectangular package allows it to be embedded inside high-end, high-power industrial equipment, and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and extreme power cooling up to 240W. The 60mm width and 120mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of very large loads. This product features a 24V high-voltage, 10.0A current drive design, making it highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms. With an ultra-low internal resistance of 1.87Ω—the lowest in this series—Joule heating losses (I²R ≈ 187W) at a current of 10.0A are effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 60 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone-coated leads (300 mm in length), capable of safely carrying the high current of 10.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure is up to 18.0 kg (0.25 kg/cm²), ensuring a tight fit between the extra-large cooling plate, the heat sink, and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.

This product is typically used in applications such as temperature control for top-tier, high-power large industrial laser modules, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the premier flagship choice for cooling applications requiring extreme power density in extra-large, high-surface-area spaces.

🔷Tec Thermoelectric Cooler Product Features

1. Extra-large, symmetrical design with ample heat exchange area

The extra-large 60×120 mm rectangular package is one of the largest models in this series, providing an extremely generous heat exchange area that is suitable for large, high-power temperature-controlled equipment.

2. High-power cooling with top-tier performance

With a maximum current of 10.0 A and a maximum power of 240 W, it achieves top-tier power density cooling within its extra-large, high-surface-area package, making it the most powerful flagship model in the series.

3. Deep cooling capability, extra-large surface area, and wide temperature differential

It achieves a maximum temperature differential of 70°C at the 240 W maximum power, with the cold end reaching as low as approximately -30°C.

4. Three Chip Options for Flexible Adaptability

Offers three chip configurations: K16 (60°C), K28 (65°C), and K40 (70°C).

5. Ultra-Low Internal Resistance Design for High Energy Conversion Efficiency

With an internal resistance of just 1.87Ω, it is the model with the lowest internal resistance in this series. Joule heat loss is effectively controlled at a high current of 10.0A, allowing more electrical energy to be converted into effective cooling capacity.

6. Ultra-Thin Design to Save Vertical Space

With a thickness of only 4.0–6.4 mm, it maintains an excellent slim profile among models operating at maximum power.

7. Excellent Power Supply Compatibility

With a maximum voltage of 24.0V, it is highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms.

8. High-Quality Substrate, Excellent Heat Dissipation Across an Extra-Large Surface Area

A thick copper layer ensures uniform heat distribution and efficient heat dissipation across an extra-large surface area of 120 mm × 60 mm.

9. Extra-Thick, Extra-Long Leads for Safe 10.0A Current Carrying Capacity

Standard 18 AWG silicone-coated wires (300 mm in length) meet the demands of high-current transmission and wiring for large-scale equipment.

10. Exceptional Adaptability to High Assembly Pressures

Recommended assembly pressure of 18.0 kg (0.25 kg/cm²) ensures tight contact with extra-large heat sinks.

11. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.

12. Bidirectional Temperature Control, Dual-Function Single Core

Reversing the current polarity activates heating mode, enabling bidirectional temperature regulation.

13. Zero Noise, Zero Vibration, Precision Operation

Fully solid-state construction ensures completely silent and vibration-free operation.

🔷Semiconductor Cooler Operation Principle

The TEC1-19510 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal lead frames to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive ceramic substrates. With 195 pairs of crystals, this is an ultra-large-scale thermoelectric stack design. It features a large number of thermocouple pairs, capable of generating a significant temperature difference and cooling capacity at moderate current levels.

When a forward DC voltage (up to 24.0 V) is applied, a high current of 10.0 A drives carriers to exchange energy at the PN junction interface—the cold end absorbs phonon energy and cools, while the hot end releases energy and heats up. Heat is continuously “pumped” from the cold end to the hot end.

The ultra-low internal resistance of 1.87 Ω is a core advantage of this product; it is the model with the lowest internal resistance in this series, effectively controlling Joule heating loss (I²R ≈ 187 W) at a high current of 10.0 A. The 0.4 mm thick copper layer helps evenly dissipate the high heat load of 240 W across the extra-large 120 mm × 60 mm surface area. This product achieves a maximum temperature difference of 70 °C when the hot end reaches 40 °C (K40 model), while the cold end can reach as low as approximately -30 °C.