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The TEC1-19515 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Devices Product Drawing
🔷Peltier Element Cooler Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-19515 | K12 | 60 | 1.25 | 24.0 | 15.0 | 360 | 60×120×3.6 |
| TEC1-19515 | K20 | 65 | 1.25 | 24.0 | 15.0 | 360 | 60×120×4.2 |
| TEC1-19515 | K28 | 70 | 1.25 | 24.0 | 15.0 | 360 | 60×120×5.2 |
🔷Thermoelectric Generator Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 20 AWG, L = 300 mm (dual wires) |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 18.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermoelectric Cooler Performance Curve
🔷Peltier Cooler Product Overview
The TEC1-19515 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series.
This product is available in three die configurations—K12, K20, and K28—with thicknesses of 3.6 mm, 4.2 mm, and 5.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 15.0 A, a maximum cooling power of 360 W, and an internal resistance of just 1.25 Ω.
Its extra-large 60 × 120 mm rectangular package allows it to be embedded inside high-end, high-power industrial equipment, and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and extreme power cooling up to 360W. The 60mm width and 120mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of very large loads. This product features a 24V high-voltage, 15.0A current drive design, making it highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms. With an ultra-low internal resistance of 1.25Ω—the lowest in this series—Joule heating losses (I²R ≈ 281.3W) at 15.0A are effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 60 mm surface area, preventing localized hot spots. It comes standard with 20 AWG silicone-coated leads (300 mm in length, twin-wire configuration), capable of safely carrying the high current of 15.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure of up to 18.0 kg (0.25 kg/cm²) ensures that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for top-tier, high-power large industrial laser modules, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the premier flagship choice for cooling applications requiring extreme power density in extra-large, high-surface-area spaces.
🔷Peltier Module Product Applications
1. Temperature Control for High-Power Large Industrial Laser Modules
High-power large industrial semiconductor laser modules generate a significant amount of heat during operation. The TEC1-19515’s 360W maximum cooling capacity enables efficient temperature control across an extra-large 60×120mm area, stabilizing the laser temperature at the setpoint ±0.05°C. It is suitable for high-power laser processing, optical communications, and LIDAR systems.
2. Heat Dissipation for Large Industrial Equipment
High-power electronic components and power modules in large industrial equipment generate concentrated heat during operation. The TEC1-19515 can be mounted directly on the component surface; its 360W maximum power rating provides robust active cooling, reducing core temperatures by more than 25°C and enhancing equipment reliability and lifespan.
3. Temperature Control for High-Performance Medical Equipment
High-end medical imaging equipment and large in-vitro diagnostic devices require a strictly controlled, constant-temperature environment. The TEC1-19515 delivers robust cooling performance thanks to its extra-large coverage area, maintenance-free operation, and stable performance.
4. Heat Dissipation for High-Power Communication Base Stations
High-power communication devices, such as 5G base stations and high-power transmitters, generate concentrated heat. The TEC1-19515 can be used for active cooling, and its 24.0V operating voltage is fully compatible with communication equipment power platforms.
🔷TEC Cooler Product Show
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Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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