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The TEC1-19525 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Peltier Device Product Drawing
🔷Peltier Device Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-19525 | K10 | 60 | 0.75 | 24.0 | 25.0 | 600 | 60×120×3.4 |
| TEC1-19525 | K14 | 65 | 0.75 | 24.0 | 25.0 | 600 | 60×120×3.8 |
| TEC1-19525 | K18 | 70 | 0.75 | 24.0 | 25.0 | 600 | 60×120×4.2 |
🔷Thermoelectric Module Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 18 AWG, L = 300 mm (dual wires) |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 18.0 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermoelectric Peltier Performance Curve
🔷TEG Module Product Overview
The TEC1-19525 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series.
This product is available in three die configurations—K10, K14, and K18—with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 25.0 A, a maximum cooling power of 600 W, and an internal resistance of just 0.75 Ω.
Its extra-large 60 × 120 mm rectangular package allows it to be integrated into high-end, high-power industrial equipment, and ultra-high-power laser modules—while ensuring a maximum cooling temperature difference of 70°C and extreme power cooling up to 600W. The 60mm width and 120mm length provide an extremely generous heat exchange area, facilitating uniform heat transfer to the surface of very large loads. This product features a 24V high-voltage, 25.0A current drive design, making it highly compatible with common industrial power supplies (24V), telecommunications equipment power supplies, and other platforms. With an ultra-low internal resistance of 0.75Ω—the lowest in this series—Joule heat loss (I²R ≈ 468.8W) at 25.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper. The relatively thick copper layer ensures uniform heat dissipation across the extra-large 120 mm × 60 mm surface area, preventing localized hot spots. It comes standard with 18 AWG silicone-coated leads (300 mm in length, twin-wire configuration), capable of safely carrying the high current of 25.0 A. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration. The recommended mounting pressure of up to 18.0 kg (0.25 kg/cm²) ensures that the extra-large cooling plate is tightly bonded to the heat sink and the surface being cooled, effectively reducing contact thermal resistance and withstanding vibrations and impacts in industrial environments.
This product is typically used in applications such as temperature control for top-tier, high-power large industrial laser modules, heat dissipation for large industrial equipment, high-performance medical devices, and high-power communication base stations. It is the ultimate flagship choice for cooling applications requiring extreme power density in extra-large, high-surface-area spaces.
🔷Solid State Cooler Product Selection
| 模型 | 热电偶对 | Umax（伏特） | Imax（安培） | DTmax（°C） | 瓦特 | 电阻器（Ω） | 长度（mm） | 宽度（mm） |
| TEC-03102-30x6x3.25 | 31 | 3.8 | 2.2 | 67 | 4.6 | 1.37 | 30 | 6 |
| TEC-03102-30x6x3.3 | 31 | 3.8 | 2.7 | 66 | 5.7 | 1.11 | 30 | 6 |
| TEC-03104-30x6x3.3 | 31 | 3.8 | 4.3 | 66 | 8.9 | 0.71 | 30 | 6 |
| TEC-06102-30x5.7x3.1 | 61 | 7.4 | 2 | 67 | 8.1 | 3 | 30 | 5.7 |
| TEC-06503-30x7x2.55 | 65 | 7.9 | 3.4 | 67 | 15 | 1.85 | 30 | 7 |
| TEC-06302-38x7.6x3.04 | 63 | 7.6 | 2.4 | 67 | 10 | 2.59 | 38 | 7.6 |
| TEC-03102-30x8x3.8 | 31 | 3.8 | 2.9 | 67 | 6.1 | 1.03 | 30 | 8 |
| TEC-07102-30x8x2.9 | 71 | 8.6 | 2.7 | 67 | 12.7 | 2.6 | 30 | 8 |
| TEC-06502-8x40x3 | 65 | 7.9 | 2.4 | 67 | 10.7 | 2.59 | 8 | 40 |
| TEC-05304-30x9.8x3.1 | 53 | 6.4 | 4.2 | 67 | 15.1 | 1.22 | 30 | 9.8 |
| TEC-01704-10x10x3.1 | 17 | 2.1 | 4.1 | 68 | 4.7 | 0.4 | 10 | 10 |
| TEC-03101-10x10x3 | 31 | 3.8 | 1.4 | 68 | 2.9 | 2.2 | 10 | 10 |
| TEC-06303-60x10x3.7 | 63 | 7.6 | 3.4 | 67 | 14.4 | 1.81 | 60 | 10 |
| TEC-04901-12x12x2.9 | 49 | 5.9 | 1.5 | 67 | 5 | 3.15 | 12 | 12 |
| TEC-03102-15x15x4 | 31 | 3.8 | 2.5 | 66 | 5.3 | 1.19 | 15 | 15 |
| TEC-03102-15x15x3.8 | 31 | 3.8 | 2.8 | 66 | 5.9 | 1.07 | 15 | 15 |
| TEC-04904-15x15x3.1 | 49 | 5.9 | 4.2 | 67 | 13.9 | 1.13 | 15 | 15 |
| TEC-04804-15x15x3.32 | 48 | 5.8 | 4.3 | 66 | 13.7 | 1.1 | 15 | 15 |
| TEC-04902-18x18x4 | 49 | 5.9 | 2.4 | 67 | 7.8 | 2.02 | 18 | 18 |
| TEC-04902-20x20x4 | 49 | 5.9 | 2.1 | 66 | 6.8 | 2.32 | 20 | 20 |
| TEC-04903-20x20x3.6 | 49 | 5.9 | 3.1 | 66 | 10.1 | 1.55 | 20 | 20 |
| TEC-07102-20x20x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 20 | 20 |
| TEC-07103-20x20x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 20 | 20 |
| TEC-06311-20x40x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 20 | 40 |
| TEC-06311-40x20x3.05 | 63 | 7.6 | 11.2 | 67 | 47.3 | 0.55 | 40 | 20 |
| TEC-07102-23x23x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 23 | 23 |
| TEC-07103-23x23x3.5 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 23 | 23 |
| TEC-04903-25x25x4.2 | 49 | 5.9 | 3.9 | 67 | 12.9 | 1.22 | 25 | 25 |
| TEC-07102-30x30x4 | 71 | 8.6 | 2.3 | 66 | 11 | 3 | 30 | 30 |
| TEC-07103-30x30x3.7 | 71 | 8.6 | 3.3 | 66 | 16 | 2.07 | 30 | 30 |
| TEC-07103-30x30x4 | 71 | 8.6 | 3.6 | 66 | 17.4 | 1.9 | 30 | 30 |
| TEC-12701-30x30x4.55 | 127 | 15.4 | 1.3 | 67 | 11.4 | 9.25 | 30 | 30 |
| TEC-12702-30x30x4.2 | 127 | 15.4 | 2 | 67 | 17.4 | 6.08 | 30 | 30 |
| TEC-12702-30x30x4.07 | 127 | 15.4 | 2.2 | 67 | 18.9 | 5.6 | 30 | 30 |
| TEC-12703-30x30x3.7 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 30 | 30 |
| TEC-12704-30x30x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 30 | 30 |
| TEC-12702-40x40x4.2 | 127 | 15.4 | 2.8 | 66 | 24.1 | 4.38 | 40 | 40 |
| TEC-12703-40x40x3.9 | 127 | 15.4 | 3.4 | 66 | 28.9 | 3.65 | 40 | 40 |
| TEC-12704-40x40x3.4 | 127 | 15.4 | 4.2 | 66 | 36.2 | 2.92 | 40 | 40 |
| TEC-12704-40x40x4 | 127 | 15.4 | 4.8 | 66 | 41.1 | 2.57 | 40 | 40 |
| TEC-12705-40x40x3.65 | 127 | 15.4 | 5.6 | 66 | 48 | 2.2 | 40 | 40 |
| TEC-12706-40x40x3.95 | 127 | 15.4 | 6.6 | 67 | 55.9 | 1.89 | 40 | 40 |
| TEC-12707-40x40x4 | 127 | 15.4 | 7.4 | 67 | 62.9 | 1.68 | 40 | 40 |
| TEC-12708-40x40x3.6 | 127 | 15.4 | 8.8 | 67 | 74.9 | 1.41 | 40 | 40 |
| TEC-12716-40x40x3.2 | 127 | 15.4 | 16.3 | 66 | 139 | 0.76 | 40 | 40 |
| TEC-06303-40x20x3.6 | 63 | 7.6 | 3 | 3.4 | 22.8 | 1.98 | 40 | 20 |
🔷Thermoelectric Power Generator Work Principle
The TEC1-19525 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive ceramic substrates. With 195 pairs of crystals, this is an ultra-large-scale thermoelectric stack design. It features a large number of thermocouple pairs, capable of generating a significant temperature difference and cooling capacity at moderate current levels.
When a forward DC voltage (up to 24.0 V) is applied, a high current of 25.0 A drives carriers to exchange energy at the PN junction interface—the cold end absorbs phonon energy and cools, while the hot end releases energy and heats up. Heat is continuously “pumped” from the cold end to the hot end.
The ultra-low internal resistance of 0.75 Ω is a core advantage of this product; it is the model with the lowest internal resistance in the series, effectively controlling Joule heat loss (I²R ≈ 468.8 W) at a high current of 25.0 A. The 0.4 mm thick copper layer helps evenly dissipate the high heat load of 600 W across the extra-large surface area of 120 mm × 60 mm. This product achieves a maximum temperature difference of 70°C (K18 model) when the hot end temperature is 40°C, while the cold end can reach as low as approximately -30°C.
The TEC1-19525 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-19520 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful, ultimate flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-19515 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-19512 is the ultimate flagship industrial semiconductor heat sink designed for ultra-large-area, top-tier extreme power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-19510 is the ultimate flagship industrial semiconductor heat sink designed for cooling extremely large areas at the highest possible power density. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-19508 is the ultimate flagship industrial semiconductor cooling module designed for extremely large areas and extreme, top-tier power density cooling. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-19506 is a top-of-the-line industrial semiconductor heat sink designed for cooling extremely large areas at extreme power densities. Measuring 60 × 120 mm, it is one of the largest models in the series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area. Optimized for large-scale industrial equipment operating at extreme power levels, ultra-high-power laser modules, high-performance medical devices, and other applications requiring extensive temperature control over a large area and handling extremely high thermal loads, it is the most powerful flagship model in the series. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
The TEC1-19505 is a flagship semiconductor cooling module designed for industrial-grade precision temperature control of extremely large areas and ultra-high power. With dimensions of 60 × 120 mm, it is currently one of the largest models in this series. Featuring an extra-large, rectangular, symmetrical package design, it provides an exceptionally large heat exchange area and is optimized for equipment requiring extremely large temperature-controlled areas and extremely high thermal loads, such as ultra-large industrial equipment, ultra-high-power laser modules, medical imaging equipment, industrial analytical instruments, and other equipment requiring large-area temperature control and capable of handling extremely high thermal loads. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
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