🔷Thermoelectric Cooling Element Basic Performance Spec

🔷Thermoelectric Cooling Device Additional Performance Spec

🔷Thermoelectric Generator Modules Product Drawing

🔷Thermoelectric Generator Modules Product Drawing

🔷Peltier Cooling Element Product Overview Peltier

The TEC1‑24102 is a high‑power single‑stage thermoelectric cooling module manufactured with premium bismuth‑telluride thermoelectric pellets, built‑in 241 thermocouple pairs and high‑performance alumina ceramic substrates, featuring a finished dimension of 60mm × 60mm. Operating based on the Peltier effect, this solid‑state thermal component enables bidirectional cooling and heating simply by reversing DC power polarity, delivering stable cooling capacity up to 38.8W, a maximum working voltage of 28.4V, maximum operating current of 2.3A, and a maximum temperature difference ΔT‑max reaching 67℃ under no‑load conditions (Hot‑side temperature Th=30℃).

Without compressors, refrigerants or moving mechanical parts, the module runs silently and vibration‑free, with fast thermal response and outstanding temperature‑control precision. It meets RoHS environmental‑compliance standards, supports long‑term continuous operation and frequent hot‑cold cycling, and can be optionally sealed with epoxy resin or silicone glue for improved moisture‑proof performance. Its large 60×60 mm heat‑exchange surface offers excellent contact area for thermal conduction, perfectly matching large‑area heat‑source cooling demands. This industrial‑grade peltier cooler is widely adopted for laser equipment cooling, laboratory constant‑temperature chambers, medical analytical instruments, industrial cabinet temperature control, semiconductor refrigeration systems and other high‑reliability thermal management projects. Custom‑made wire length, surface sealing and substrate upgrades are available upon request.

🔷 Product Applications

This large‑size, high‑power single‑stage thermoelectric cooling module is engineered for medium‑and‑high heat‑load thermal‑management projects. Its 60×60 mm large ceramic surface provides ample contact area for uniform heat transfer, making it ideal for equipment requiring stable long‑time cooling, heating or bidirectional precise temperature control. Without compressors, refrigerants or moving components, the peltier module delivers silent, vibration‑free operation and rapid thermal response, and is widely deployed across optoelectronics, medical‑biomedical, laboratory‑scientific, industrial automation, commercial refrigeration and custom‑built temperature‑controlled systems.

1. Optoelectronic & Photonic Equipment Cooling

Perfect for high‑power laser modules, industrial laser heads, laser engraving equipment, infrared detectors, thermal imaging cameras and optical sensor temperature stabilization. The module dissipates concentrated heat generated during continuous‑laser operation, stabilizes component working temperature, prevents wavelength drift and guarantees long‑term optical performance and measurement accuracy.

2. Medical & Biochemical Instrumentation

Applied to biochemical analyzers, constant‑temperature reaction chambers, PCR testing devices, portable medical refrigerators, biological‑sample storage equipment and diagnostic analytical instruments. It achieves accurate and stable temperature holding for blood, reagents and biological specimens, supporting 24‑hour non‑stop reliable operation in clinical‑grade medical thermal‑control solutions.

3. Laboratory & Scientific Research Equipment

Serves as core cooling‑heating element for benchtop constant‑temperature tanks, small‑size circulating chillers, environmental test chambers, dew‑point meters and material‑testing platforms. Bidirectional cooling‑heating function allows flexible temperature cycling experiments, meeting strict precision‑temperature‑control requirements for university and industrial‑research laboratories.

4. Industrial Cabinet & Electronic Thermal Management

Used for temperature regulation of industrial control enclosures, battery thermal management systems, high‑power power‑supply modules, PLC cabinets and sealed electrical‑box cooling. It actively removes internal waste heat and avoids over‑temperature shutdown caused by high‑density heat accumulation inside closed industrial equipment.

5. Commercial Thermoelectric Refrigeration & Heating Products

Suitable for large‑area semiconductor cold plates, industrial‑grade wine coolers, electronic ice‑water machines, large‑capacity thermoelectric incubators and customized solid‑state refrigeration units. The large 60×60 mm heat‑exchange face greatly improves contact fit‑up with large cooling plates.

6. Beauty, Aesthetic & Special‑Purpose Temperature‑Controlled Devices

Matches high‑power skin‑treatment laser machines, cryotherapy instruments and large‑surface cold‑therapy equipment, delivering stable low‑temperature output for large contact cooling zones.

7. Custom OEM Thermal‑Control Projects

This industrial‑grade peltier cooler supports custom system integration for most non‑compressor refrigeration and heating projects. Custom options such as lead‑wire length, epoxy sealing and surface insulation treatment are available upon your request to adapt to harsh‑humidity, frequent hot‑cold cycling and long‑life operating environments.

🔷Product Structure

The TEC1‑24102 is a single‑stage thermoelectric cooling module adopting classic sandwich‑type laminated structure, assembled with two high‑thermal‑conductivity alumina ceramic substrates, copper conductive tabs, 241 pairs of high‑performance bismuth‑telluride PN thermoelectric pellets, high‑temperature‑resistant solder joints and insulated lead‑out wires. All internal thermocouple pellets are electrically connected in series and thermally arranged in parallel, which optimizes heat‑transfer efficiency on the 60 mm × 60 mm large contact surface and ensures uniform temperature distribution across the cold and hot sides.

1. Upper & Lower Ceramic Substrates

Two square‑shaped 60×60 mm alumina ceramic plates form the out‑most layers of the module. The ceramic substrate provides excellent electrical insulation, high thermal conductivity, mechanical support and corrosion‑resistance. One ceramic surface works as cold‑side heat‑absorption plane while the other serves as hot‑side heat‑dissipation plane. The large‑area flat surface guarantees full contact with cold plates and heat sinks, reducing thermal contact resistance during installation.

2. Copper Conductive Tabs (Electrodes)

Metal‑plated copper conductive circuits are sintered on the inner face of each ceramic substrate. These copper tabs connect adjacent N‑type and P‑type semiconductor pellets, forming a continuous closed‑loop electric path. High‑purity copper material lowers internal resistance, reduces extra power consumption and heat generation during long‑time operation.

3. PN Thermoelectric Pellets (Core Thermoelectric Element)

A total of 241 pairs of N‑type and P‑type bismuth‑telluride thermoelectric grains are arranged alternately between two ceramic substrates. Bismuth‑telluride alloy is selected for its outstanding thermoelectric conversion efficiency under normal‑temperature working environment. This is the core component to realize heat‑pumping function via the Peltier effect.

4. Solder Joint Layer

High‑reliability lead‑free solder is applied between semiconductor pellets and copper conductive tabs. The soldering layer firmly bonds each thermoelectric grain with conductive copper sheets, delivering good shear‑resistance and thermal‑fatigue resistance to withstand repeated hot‑cold cycling without easy‑fracture risk.

5. Lead‑out Wires & Terminal

Two insulated tinned copper wires (positive and negative) are welded onto the outermost copper conductive tabs for DC power input. Standard wire length is available, custom‑extended wires can be offered on request. Reversing the polarity of DC power will swap cold‑side and hot‑side function.

6. Optional Edge‑Sealing Structure

Epoxy resin or silicone glue sealing can be added around the module perimeter as an optional upgrade. The sealing layer protects internal pellets and solder joints from moisture, dust and condensation corrosion, greatly improving service life for high‑humidity working environments.

Overall Mechanical Dimensions

Outer dimension: 60 mm × 60 mm; standard overall thickness: approx. 3.8‑4.0mm; flat, smooth ceramic surface without pre‑drilled mounting holes. Users need to apply thermal grease when assembling with heat‑sink and cold plate.

🔷 Operation Principle

The TEC1‑24102 single‑stage thermoelectric cooling module works based on the Peltier effect, one of the fundamental thermoelectric physical effects. When a direct‑current flows through two different types of conductive materials connected in a closed loop, heat transfer occurs across the junction of these two conductors. One junction continuously absorbs heat and turns into the cold side, while the other junction releases heat and becomes the hot side.

Inside this 60×60 mm peltier cooler, there are 241 pairs of alternating N‑type and P‑type bismuth‑telluride thermoelectric pellets. All thermoelectric pellets are electrically connected in series by copper conductive tabs and thermally arranged in parallel between the top and bottom alumina ceramic substrates.

After stable DC power is supplied to the lead‑out wires, electric current passes sequentially through every PN thermocouple pair. Under the Peltier effect, heat energy is pumped from one ceramic substrate surface to the opposite side. The surface that absorbs heat is defined as the cold side for target‑object cooling, and the surface releasing heat is the hot‑side which must be equipped with an external heat‑dissipation system such as a heat sink, cooling fan or water‑cooled cold plate.

A critical feature of the TEC1‑24102 module is bidirectional temperature control. If the polarity of the input DC power is reversed, the direction of heat‑pumping will be flipped. The original cold‑side becomes the heating surface and the former hot‑side turns into the cooling surface. This function enables both active cooling and precise heating with one single module.

It should be noted that the peltier module itself cannot eliminate heat; it only transfers heat from the cold side to the hot side. To achieve the rated maximum temperature difference (ΔT‑max) and long‑term stable cooling performance, sufficient heat dissipation on the hot‑side is mandatory. Poor heat dissipation will cause hot‑side temperature to rise rapidly, reduce cooling efficiency and even lead to permanent thermal damage to the internal semiconductor pellets.

The alumina ceramic substrates on both sides act as thermal transfer medium and electrical isolator. They conduct heat quickly to or from the external heat‑exchange structure while preventing electric leakage between the internal semiconductor grains and the installed metal cold plate or heat sink.