🔷Thermoelectric Cooling Element Basic Performance Spec

🔷Thermoelectric Cooling Device Additional Performance Spec

🔷Thermoelectric Generator Modules Product Drawing

🔷Thermoelectric Generator Modules Product Drawing

🔷Peltier Cooling Element Product Overview Peltier

The TEC1-24103 is a high-performance 60×60mm square thermoelectric Peltier cooling module engineered for reliable solid-state thermal management across commercial, industrial, and precision electronic systems. Utilizing the advanced Peltier effect principle, this module achieves bidirectional heat transfer—delivering active cooling or precise heating without compressors, refrigerants, or moving parts, enabling maintenance-free, low-noise, and highly responsive temperature regulation for diverse thermal control scenarios.

Featuring 241 thermocouple pairs inside its compact standardized 60×60mm footprint, this Peltier unit exhibits stable and superior thermal performance under rated operating conditions (reference temperature Th=27°C). It supports a maximum operating current of 3.9A and a maximum driving voltage of 28.4V, delivering a peak cooling capacity of 65.8W at zero temperature difference (ΔT=0°C) and achieving a maximum temperature differential of 67°C when cooling load is zero (Qc=0W). Its standard internal resistance is 4.7Ω, ensuring consistent power conversion efficiency and stable electrical operation under matched DC driving circuits.

Structurally optimized for durability and universality, the module adopts double-sided high-strength ceramic substrates with excellent thermal conductivity, electrical insulation, and pressure resistance, with a maximum compressive load of 1MPa to adapt to standard mechanical assembly and heat sink mounting. The module applies premium silicone gel sealing technology to effectively resist moisture, dust, and mild environmental corrosion, extending service life in complex working environments. All dimensional flatness and height tolerances are strictly controlled within industrial standard ranges (flatness ±0.05mm, height tolerance ±0.2mm), guaranteeing tight fitting contact with heat dissipation components and minimizing thermal resistance for optimal heat transfer efficiency. Standard 150mm lead wires are pre-installed for convenient circuit connection and system integration.

The TEC1-24103 Peltier cooler supports a wide operating temperature range of -50°C to 100°C, with a solder melting point of 138°C, ensuring safe and stable long-term operation within conventional application thresholds. Its solid-state design eliminates mechanical vibration and operational noise, while the filterless and refrigerant-free structure meets environmental protection and low-maintenance requirements, making it compliant with mainstream industrial application specifications.

Widely applicable for precision temperature control, the module is ideal for small refrigeration equipment, industrial enclosure cooling, electronic component heat dissipation, laboratory constant-temperature devices, medical analytical instruments, and consumer thermostatic equipment. It serves as a cost-effective, high-reliability thermal management solution for scenarios requiring accurate, fast, and reversible heating and cooling adjustment.

🔷 Product Applications

Thanks to its large‑size 60×60 mm heating‑cooling surface, high cooling‑power output and bidirectional temperature‑adjustment capability, the TEC1‑24103 Peltier thermoelectric module can be deployed across industrial, laboratory, medical and commercial thermal‑control projects.

Industrial Cabinet & Electronic Thermal Management

It provides reliable spot cooling or constant‑temperature maintenance for power‑supply cabinets, laser modules, high‑power semiconductors and automation control units. With vibration‑free solid‑state operation, this cooler avoids mechanical interference to precision‑sensitive electronics while removing surplus heat steadily.

Laboratory and Scientific Testing Equipment

The module is perfectly suited for lab‑grade constant‑temperature platforms, sample‑cooling holders, reagent temperature‑control chambers and optical‑sensor temperature stabilizers. Its wide temperature‑difference performance allows researchers to achieve fast, reversible heating and cooling cycles with fine‑tuned thermal stability.

Medical and Analytical Instrumentation

It acts as a core temperature‑control component for diagnostic detectors, biological sample storage trays, biochemical analysers and portable medical constant‑temperature devices. Refrigerant‑free operation meets clean‑room requirements and reduces routine maintenance work for medical‑grade systems.

Commercial Small‑Scale Refrigeration & Thermostatic Devices

The large 60 mm × 60 mm cold surface makes this TEC module an excellent thermal core for high‑capacity thermoelectric refrigerators, wine cabinets, portable ice‑free coolers, heating‑cooling dual‑function drink dispensers and small‑size constant‑temperature storage boxes.

Custom‑Built Special‑Purpose Thermal Systems

Engineers can integrate the TEC1‑24103 into bespoke thermal test jigs, environmental mini‑chambers, battery thermal management assemblies and other custom thermal‑control projects where no compressor‑based cooling solution is feasible.

🔷Product Structure

The TEC1‑24103 thermoelectric cooling module is a compact, solid‑state thermal‑control component assembled with multi‑layered, high‑reliability materials in a laminated sandwich‑type structure. The overall outer dimension of this Peltier cooler measures 60 mm × 60 mm, providing a large flat thermal‑transfer surface for sufficient contact area with heat sinks or cold‑side fixtures.

Two high‑quality aluminium‑oxide ceramic substrates form the outermost top and bottom layers of the module. These ceramic plates deliver outstanding thermal conductivity for fast heat conduction, excellent electrical insulation to prevent short‑circuit risks between internal circuits and external mounting hardware, as well as strong mechanical rigidity to resist deformation during installation. Both cold‑side and hot‑side ceramic surfaces are finished with high flatness, which helps eliminate air gaps during assembly and effectively lowers interface thermal resistance.

Sandwiched between the two ceramic substrates are 241 pairs of N‑type and P‑type bismuth‑telluride thermoelectric pellets, the core functional material of the Peltier unit. These semiconductor pellets are arranged in a dense, parallel array and electrically connected in series by high‑conductivity copper interconnects, while thermally connected in parallel. This layout converts supplied DC power into bidirectional heat transfer, achieving active cooling or heating on opposite sides of the module.

High‑temperature‑resistant solders are applied between thermoelectric pellets and copper conductors, as well as between copper bridges and inner ceramic metallized layers. Firm solder joints guarantee stable electrical conductivity and prevent delamination under repeated thermal cycling, reducing the risk of open‑circuit failure caused by frequent temperature swings.

Insulating and sealing materials are filled around the edge gap between the upper and lower ceramic substrates. Industrial‑grade silicone sealant wraps the side perimeter of the thermoelectric pellet array, protecting internal semiconductor elements against moisture, dust, condensation and mild corrosive gas in working environments. The edge‑sealed construction slows down oxidation and improves the long‑term service life of the module.

Two flexible stranded‑copper lead‑wires are pre‑soldered onto the copper circuit terminals for DC power input. Standard‑length leads allow convenient wiring and system integration. Polarity is clearly defined: reversing the DC voltage will switch the heating and cooling sides of the Peltier module.

All structural components are strictly assembled under standardized production processes. Height tolerance, surface flatness and compressive‑load resistance of the finished 60×60 mm module comply with industrial thermoelectric module specifications, making the TEC1‑24103 mechanically compatible with most standard heat sinks, thermal interface materials and clamping mounting solutions.

🔷 Operation Principle

The TEC1‑24103 thermoelectric cooler operates based on the well‑known Peltier effect, a fundamental physical phenomenon of solid‑state heat transfer. Unlike compressor‑based refrigeration systems that rely on circulating refrigerant, this module realizes active cooling and heating purely through electric energy conversion, with no moving parts, vibration or noise‑generating mechanical structures.

Inside the 60×60 mm module, 241 pairs of N‑type and P‑type bismuth‑telluride semiconductor pellets are electrically connected in series by copper conductors and thermally connected in parallel between two electrically‑insulated ceramic substrates. When a direct‑current (DC) power supply is applied across the two lead wires, charge carriers begin to flow through the semiconductor circuit.

As electric current passes from the N‑type thermoelement to the P‑type thermoelement at one ceramic interface, heat energy is absorbed from the surrounding environment. This side becomes the cold surface of the TEC1‑24103 module, which can remove heat from attached objects and achieve active cooling. At the opposite ceramic interface where current flows from the P‑type pellet back to the N‑type pellet, heat is released into the external environment, forming the hot‑side surface that must be equipped with a matched heat‑dissipation system such as a heat sink, fan or water‑cooling radiator.

The direction of heat transfer can be easily reversed by switching the polarity of the input DC voltage. Once the power polarity is inverted, the cold‑side and hot‑side surfaces swap positions, allowing the module to switch from cooling mode to heating mode instantly. This bidirectional thermal‑control feature enables precise, fast and flexible temperature regulation above or below ambient temperature.

It should be noted that the maximum temperature difference between the two sides of the TEC1‑24103 depends heavily on adequate hot‑side heat dissipation. Without effective heat removal from the hot face, excess accumulated heat will conduct back to the cold side, reducing cooling efficiency, limiting the achievable temperature drop and potentially shortening the service life of the thermoelectric module.

During operation, part of the input electrical power is converted into heat by Joule heating, an unavoidable energy loss caused by internal electrical resistance. Proper power‑supply configuration, thermal interface material and clamping pressure on the 60 mm × 60 mm ceramic surface are required to optimize overall cooling performance and long‑term operational stability.