🔷Thermoelectric Cooling Element Basic Performance Spec
| Type Mode | Chip | ▲Tmax(°C) | ACR ohm(Ω) | Umax(V) | Imax(A) | Pmax(W) | Size(mm) |
|---|
| TEC1-24106 | K10 | 60 | 3.77 | 29 | 6 | 174 | 60x60x3.4 |
| K16 | 65 | | | | | 60x60x4.0 |
| K22 | 70 | | | | | 60x60x4.6 |
🔷Thermoelectric Cooling Device Additional Performance Spec
| Specification Item | Description |
|---|
| Substrate | 96% Alumina 0.76mm + Oxygen-Free Copper 0.4mm, sintered process |
| Lead Wire | Extra-soft silicone wire, 20 AWG, L = 300mm |
| Terminal | Standard product without terminals; can be installed upon request |
| Assembly Pressure | 9 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealing Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermoelectric Generator Modules Product Drawing
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🔷Thermoelectric Generator Modules Product Drawing
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🔷Peltier Cooling Element Product Overview Peltier
The TEC1-24106 is a high-power single-stage thermoelectric cooling (Peltier) module with an upgraded 60×60mm outer dimension, engineered for reliable solid-state heat transfer, precise bidirectional temperature control, and high-load industrial cooling and heating scenarios. Built with 241 pairs of high-quality thermoelectric semiconductor couples and premium ceramic substrates, this module delivers stable and efficient thermoelectric conversion, solving the heat dissipation and constant-temperature control demands of medium and high-power electronic and electromechanical equipment.
Adopting advanced solid-state thermoelectric technology, the module features no mechanical moving parts, zero noise operation, no vibration, and no refrigerant pollution, fully complying with RoHS environmental compliance standards. It supports instant cooling and heating switching with a fast thermal response speed, enabling accurate micro-temperature adjustment. Under standard test conditions (hot side temperature Th=27°C), the module achieves a maximum operating current of 6A, a maximum working voltage of 28.4V, a peak cooling capacity of 101.2W, and a maximum temperature difference of 67°C between the cold and hot sides, providing outstanding heat exchange efficiency and stable thermal performance.
The upgraded 60×60mm enlarged size optimizes the heat conduction area compared with conventional 55×55mm modules, effectively reducing unit heat load, lowering local thermal resistance, and improving overall heat dissipation uniformity and long-term operational stability. The product adopts a high-strength integrated packaging process with optional RTV silicone sealing or epoxy resin sealing treatment, which enhances waterproof, dustproof and anti-oxidation capabilities, effectively resisting temperature impact and structural aging in complex industrial environments. Its internal resistance is stabilized at 4.0Ω, with consistent batch performance and low attenuation, ensuring continuous and reliable long-cycle operation.
Widely adaptable to diversified precision temperature control scenarios, this Peltier module is extensively applied in industrial equipment constant-temperature systems, laboratory analytical instruments, medical and biochemical constant-temperature devices, semiconductor heat dissipation systems, portable refrigeration and heating equipment, and precision optoelectronic temperature control units. As a high-performance and cost-effective thermoelectric component, it is an ideal core solution for medium-power precise cooling, active heat dissipation and bidirectional constant-temperature control in civilian and industrial fields.
🔷 Product Applications
The 60×60 mm TEC1‑24106 high‑power Peltier cooler is designed for medium‑to‑high‑load active thermal management and bidirectional temperature regulation, bringing solid‑state, noise‑free cooling or heating to a broad range of industrial, medical, laboratory and commercial‑grade equipment.
Industrial Precision Temperature‑Control Systems
Thanks to its large heat‑transfer area and 101.2 W peak cooling capacity, this thermoelectric module serves as an excellent thermal core for industrial constant‑temperature platforms, process‑cooling assemblies and electronic cabinet thermal stabilisation. Its stable long‑run performance and low thermal‑resistance 60×60 mm ceramic surface deliver uniform heat distribution, preventing local overheating for high‑power drives, power supply modules and automation components. It can maintain tight set‑point temperatures without compressor‑related vibration or noise.
Laboratory & Analytical Instrumentation
Fast thermal response and accurate micro‑temperature adjustment make the TEC1‑24106 well‑suited for lab equipment requiring precise thermal cycling or isothermal holding. Typical uses include sample cooling/heating chambers, spectroscopic devices, sensor calibration fixtures and constant‑temperature test benches. The refrigerant‑free, RoHS‑compliant solid‑state design eliminates contamination risks for sensitive test samples.
Medical & Biochemical Constant‑Temperature Equipment
This single‑stage thermoelectric cooler provides reliable thermal control for portable medical refrigeration, reagent storage compartments, biological incubators and skin‑contact therapeutic cooling devices. Bidirectional cooling‑heating switching allows equipment designers to build systems that stabilise temperatures within narrow ranges, while sealed packaging options improve durability in humid clinical environments.
Semiconductor & Optoelectronic Heat Dissipation
High‑heat‑flux laser modules, high‑brightness lighting assemblies, optical sensors and high‑performance chip‑on‑board systems benefit greatly from the enlarged 60×60 mm cooling surface. The module actively pulls excess heat away from heat‑sensitive optoelectronic and semiconductor components, stabilising operating temperature to reduce wavelength drift, extend component service life and improve measurement accuracy.
Portable Refrigeration & Heating Devices
With no moving parts and compact flat construction, the TEC1‑24106 Peltier element is an ideal thermal core for custom‑built thermoelectric coolers, insulated portable cold boxes, beverage temperature controllers and dual‑function warm‑cold cabinets. Designers can quickly switch between cooling and heating modes simply by reversing the input power polarity, offering flexible all‑in‑one thermal solutions for off‑grid and mobile equipment.
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🔷Product Structure
The TEC1‑24106 60×60 mm thermoelectric cooling module adopts a classic single‑stage sandwich‑layer structure, assembled from high‑quality ceramic substrates, thermoelectric semiconductor pellets, copper conductive electrodes, solder layers and outer sealing material.
The top and bottom layers are high‑density alumina ceramic plates, with an outer dimension of 60 mm × 60 mm. The ceramic substrate features excellent thermal conductivity, high electrical insulation, good flatness and strong compression‑resistant performance. It acts as the heat‑exchange surface on both cold and hot sides, ensuring uniform heat transfer and preventing short‑circuit risks between internal circuits.
Sandwiched between the two ceramic boards are 241 pairs of N‑type and P‑type bismuth‑telluride thermoelectric pellets. These semiconductor grains are arranged in an orderly matrix. Each pellet is electrically connected in series via copper‑foil electrodes, while thermally connected in parallel. This layout converts electric energy into temperature difference through the Peltier effect, realizing fast cooling or heating function by changing the current direction. High‑precision soldering material is applied between copper electrodes and semiconductor pellets, which guarantees low contact resistance, reduces heat loss and improves long‑term working stability.
The outer edge of the module can be filled and sealed with RTV silicone or epoxy resin sealant. The sealing layer wraps the side gaps of ceramic substrates and internal components, effectively blocking moisture, dust and corrosive gas. It prevents oxidation of solder joints and semiconductor elements, and improves the module’s environmental adaptability and service life.
With a large‑area 60×60 mm structural design, the module provides bigger heat‑transfer contact surface compared with standard‑size peltier coolers. It helps lower surface heat‑flux density, reduce local overheating and thermal stress, and achieve more balanced temperature distribution during high‑power continuous operation. No compressors, fans or other moving mechanical parts are built inside the module, delivering compact, flat and solid‑state construction for easy installation into cooling assemblies.
🔷 FAQ
Q: What is the maximum temperature difference of this peltier module?
A: For TEC1‑24106 thermoelectric cooling module, the max ΔT can reach around 68℃ under no‑load condition with hot‑side temperature at 27℃. Reliable heat dissipation is essential to achieve full‑performance output.
Q: What power supply should I use for this thermoelectric element?
A: TEC1‑24106 rated max voltage 29.2V, max current 6.0A. For longer service life, operate below the maximum rated current.
Q: Can this peltier cooler realize both cooling and heating?
A: Yes. This TEC1‑24106 peltier module supports bidirectional cooling and heating. Simply reverse DC power input to swap cold‑side and hot‑side.
Q: What are the key installation requirements?
A: Install adequate heat‑sink on hot‑side. Apply thermal grease evenly and maintain uniform assembly pressure. Avoid mechanical impact and over‑current operation.
Q: What factors will shorten thermoelectric module service life?
A: Poor heat dissipation, over‑current, uneven mounting pressure and moisture ingress will accelerate aging of TEC1‑24106 peltier cooler.
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